In electronic packaging products in the service process, the solder joints experience thermal fatigue due to temperature cycles, which have a significant influence on the performance of electronic products and the reliability of solder joints. In this paper, the thermal fatigue failure mechanism of solder joints in microelectronic packages, the microstructure changes of the thermal fatigue process, the influence factors on the joint fatigue life, and the simulation analysis and forecasting of thermal fatigue life are reviewed. The results show that the solder joints are heterogeneously coarsened, and this leads to fatigue cracks occurring under the elevated high-temperature phase of alternating temperature cycles. However, the thickness of the solder and the hold time in the high-temperature phase do not significantly influence the thermal fatigue. The coarsened region and the IMC layer thicken with the number of cycles, and the cracks initiate and propagate along the interface between the intermetallic compound (IMC) layer and coarsened region, eventually leading to solder joint failure. For lead-containing and lead-free solders, the lead-containing solder shows a faster fatigue crack growth rate and propagates by transgranular mode. Temperature and frequency affect the thermal fatigue life of solder joints to different degrees, and the fatigue lifetime of solder joints can be predicted through a variety of methods and simulated crack trajectories, but also through the use of a unified constitutive model and finite element analysis for prediction.

Laser powder bed fusion (L-PBF) additive manufacturing technology can print multi-material parts with multiple functions/properties, and has great potential for working in harsh application environments. However, the metal blank formed by sintering metal powder material with binder added through L-PBF has an obvious porous structure and insufficient mechanical properties, and few studies have been conducted studying this. In this paper, epoxy resin was used to impregnate the blank of porous metal parts formed by L-PBF with iron-based powder material at a certain temperature, and a cross-linked curing reaction was carried out with three kinds of phenolic resin in different proportions under the action of a curing agent, so as to fill the pores and achieve the desired mechanical properties. The characteristic peaks of each group of epoxy resin were characterized using Fourier transform infrared spectroscopy (FT-IR) and H-nuclear magnetic resonance (¹H-NMR) spectrums. The microstructure, decomposition temperature, and residue of four epoxy resin dispersion systems were analyzed with a scanning electron microscope (SEM), a thermal gravimetric analyzer (TGA), and derivative thermogravimetry (DTG). The results show that the density of the porous metal parts was obviously improved, the heat resistance temperature of the parts could reach 350 °C, and the tensile strength of the sample after EP2-1 impregnation was increased by 4–6 times after curing at 160 °C for 6 h. Therefore, the use of an epoxy resin dispersion system can increase the porosity of L-PBF porous metal parts, but can also significantly improve their mechanical properties, which can help them to meet the requirements of applications as model materials, biological materials, and functional materials to provide a feasible solution.