This study aimed to investigate the fatigue performance and interfacial strengthening mechanisms of Al6061-to-Cu dissimilar lap joints via electromagnetic pulse welding (EMPW). The load-bearing capacity of the joints at discharge voltages of 14 kV and 16 kV was superior to that of 12 kV. Furthermore, the fatigue life of the 14 kV joints was one order of magnitude higher compared to the 12 kV joints. SEM observation of the fatigue fracture surface revealed the presence of typical "tire-mark" fatigue striations only in the 14 kV joint, indicating higher ductility and the ability to withstand extended plastic deformation. Notably, ultra-fine nanocrystalline Al2Cu phase, amorphous phase, and numerous dislocations hindered EBSD acquisition in the transition zone. Nevertheless, dense low-angle grain boundaries (LAGBs) and refined grains were examined at the bonding interface. This suggests that the high-velocity collision caused severe plastic deformation and led to the formation of substructures. The interfacial strength was attributed not only to the "wave-like" or "inverted hook-like" diffusion layer but also to the presence of refined grains along the interface and nanocrystalline Al2Cu in the transition zone. Furthermore, the hybrid nanocrystalline-amorphous microstructure strengthened the joint by regulating the balance between strength and ductility.

This study investigated the fatigue properties and interfacial strengthening mechanisms of Al6061-to-Cu dissimilar welded joints via electromagnetic pulse welding (EMPW). The load-bearing capacity of the joints at discharge voltages of 14 kV and 16 kV was superior to that of 12 kV. Meanwhile, the fatigue life of 14 kV joints was one order of magnitude higher than that of 12 kV. The SEM observation on the fatigue fracture surface shows that the typical “tire-mark” fatigue striation just appeared on the 14 kV joint, indicating higher ductility for handling more extended plastic deformation. The high EBSD acquisition was achieved except for the transition zone due to the formation of ultra-fine nanocrystalline Al2Cu phase and amorphous phase, along with many dislocations. Dense low-angle grain boundaries (LAGBs) and refined grains are formed along the bonding interface. This indicates that severe plastic deformation induced dislocations to form the substructure in such an instant (40-60 μs) during the high-velocity collision. The interfacial strength is not only due to the continuous interfacial diffusion layer with a “wave-like” or “inverted hook-like” pattern but also benefits from refined grains along the interface and in the transition zone, as well as the hybrid amorphous-nanocrystalline microstructure, which strengthens the joint through increasing ductility induced by refined grains and regulating amorphous or nanocrystalline phases to affect the balance between strength and ductility of the Al/Cu joint.