Thang Tran

Dr. Thang Tran

Polymer Processing Group, Manufacturing Process Division, Singapore Institute of Manufacturing Technology, Singapore
orcid

Research Focus & Metrics

Academic Career Length

8Years (2019-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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5 July 2019 in Metals
Verified
Journal Article
Open access
PDF file
Thang TranThang Tran
Thang Tran
ACAmutha Chinappan
Amutha Chinappan
JLJeremy Kong Yoong Lee
Jeremy Kong Yoong Lee
NLNguyen Huu Loc
Nguyen Huu Loc
LTLong T. Tran
Long T. Tran
Seeram RamakrishnaSeeram Ramakrishna
Seeram Ramakrishna
Copper has been widely used in many applications due to its outstanding properties such as malleability, high corrosion resistance, and excellent electrical and thermal conductivities. While 3D printing can offer many advantages from layer-by-layer fabrication, the 3D printing of highly pure copper is still challenging due to the thermal issues caused by copper’s high conductivity. This paper presents a comprehensive review of recent work on 3D printing technology of highly pure copper over the past few years. The advantages and current issues of 3D printing methods are compared while different properties of copper parts printed by these methods are summarized. Finally, we provide several potential applications of the 3D printed copper parts and an overview of current developments that could lead to new improvements in this advanced manufacturing field.