Many insects are able to walk vertically or upside down on both hard and soft surfaces. In beetles such as the ladybird (Coccinella septempunctata), intermolecular forces between tarsal setae on the footpads of the insects make this movement possible. In prior work, adhesion structures made from polydimethylsiloxane (PDMS) that mimic the action of the tarsal setae have been developed. It is proposed that these adhesion structures could be attached to a simplified version of the leg of a ladybird and used in practical applications. For example, the leg structures could potentially be employed in small surveillance drones to enable attachment to surfaces during flights, in order to preserve battery power. Alternatively, the structures could be used in small robotic devices to enable walking on steeply inclined surfaces. In this program of work, the morphology and movement of the leg of a ladybird were closely studied using a 3D X-ray microscope and a high-speed microscope. The positions of the tendons that facilitated movement were identified. From this knowledge, a simplified leg structure using pin-joints was designed and then fabricated using 3-D printing. The PDMS adhesion structures were then attached to the leg structure. The tendons in the actual insect leg were replicated using thread. Typical detachment forces of about 4 N indicated that the simplified leg structure was, in principle, more than capable of supporting the weight of a small device and then detach successfully. Attachment/detachment movement operations were performed using a linear actuator and controlled remotely. Therefore, proof of concept has been demonstrated for the use of such a simplified ladybird leg structure for the attachment/detachment of small robotic devices to horizontal, inclined, or vertical surfaces.
20 December 2024 in Journal of Materials Science: Materials in Engineering
Surface-activated bonding (SAB) of a 3D-printed Ti-6Al-4V pillar structure (fabricated by selective laser melting) to pure bulk aluminum at room temperature has been investigated. Argon beam irradiation was used to remove surface contaminants and “activate” the surfaces prior to bonding. The surface chemistry of the Ti-6Al-4V surface was analyzed using Electron Spectroscopy for Chemical Analysis (ESCA) to make sure any oxides had been removed by the irradiation procedure. The two materials were successfully bonded via SAB using special bonding apparatus, and scanning transmission electron microscopy (STEM) observation revealed a flat well-bonded interface with no obvious porosity. Furthermore, no thick reaction layer that could compromise the strength of the bond was evident. An oxide layer approximately 2 nm in thickness was observed at the interface by high-resolution TEM, but this is not considered sufficient to have a detrimental effect on bond integrity. The results of the investigation show that 3D-printed materials and structures can be successfully joined to aluminum by SAB techniques.
Ductility-dip cracking is a type of solid-state cracking with corresponding ductility loss that is associated with solidification processes in FCC metals and alloys, including Ni-based alloys, at temperatures of typically 0.5 – 0.7 of the alloy melting point. The prevalence of this type of cracking during the tensile deformation of additively manufactured Inconel 738LC at elevated temperature was investigated in this study. Dog bone specimens were machined from IN738LC cylindrical samples fabricated via laser powder bed fusion. Noticeable ductility reduction was observed under tensile loading at 800°C – 900°C. Additionally, it was discovered that extensive cracking at intra-columnar high angle grain boundaries occurred along with significant γʹ precipitation, following tensile loading at 900°C. Furthermore, formation of γʹ along the high angle intra-columnar grain boundaries was revealed via transmission electron microscopy. It is concluded that the presence of a thin, discontinuous layer of grain boundary γʹ causes a loss of cohesion, and therefore weakens the boundaries, leading to easier grain boundary sliding, and ultimately, cracking.
21 September 2026 in Materials Science and Engineering: A