An ultrathin dual-band eight-element multiple input–multiple output (MIMO) antenna operating in fifth-generation (5G) 3.4–3.6 GHz and 4.8–5 GHz frequency bands for future ultrathin smartphones is proposed in this paper. The size of a single antenna unit is 9 × 4.2 mm² (0.105 λ × 0.05 λ, λ equals the free-space wavelength of 3.5 GHz). Eight antenna units are structured symmetrically along with two sideboards. Two decoupling branches (DB1 and DB2) are employed to weaken the mutual coupling between Ant. 1 and Ant. 2 and between Ant. 2 and Ant. 3, respectively. The measured −10 dB impedance bands are 3.38–3.82 GHz and 4.75–5.13 GHz, which can entirely contain the desired bands. Measured isolation larger than 14.5 dB and 15 dB is obtained in the first and second resonant modes, respectively. Remarkable consistency between the simulated and measured results can be achieved. Several indicators, such as the envelope correlation coefficient (ECC), diversity gain (DG), total active reflection coefficient (TARC), and multiplexing efficiency (ME), have been presented to assess the MIMO performance of the designed antenna.

This paper presents a symmetric dual-band multiple-input multiple-output (MIMO) antenna system tailored for fifth-generation (5G) mobile terminals. Operating within the 5G frequency bands N77/N78 (3.4–3.6 GHz) and N79 (4.8–5.0 GHz), the proposed MIMO system achieves high isolation between adjacent antenna elements through slotting and self-decoupling technologies. Antenna elements are strategically positioned on two frames perpendicular to the smartphone’s main board. Each antenna element integrates a rectangular microstrip radiator on the inner frame surface, accompanied by a grounded rectangular ring on the outer frame surface. The feed line, situated atop the main board, connects to an external SMA connector located at the main board’s bottom. Measurement results reveal isolations exceeding 20 dB for the lower band and 24 dB for the higher band. The fabricated and tested MIMO antenna system demonstrates excellent agreement between simulation and measurement outcomes.

This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless technologies. The proposed architecture not only reduces the integration complexity but also considers the architectural design of the integrated module, impedance matching techniques, and signal integrity for carrier aggregation (CA) technology realization. The feasibility of employing SOI switches and SAW filters based on SiP design has been validated through the trial production of a Sub-3GHz radio frequency (RF) front-end diversity receiver module. The resulting RF front-end module demonstrates exceptionally high packaging density and enhanced communication reliability, rendering it suitable for diverse applications in miniaturized RF systems.