Quantum dots (QDs) have been explored for many photonic applications, both as emitters and absorbers. Thanks to the bandgap tunability and ease of processing, they are prominent candidates to disrupt the field of imaging. This review article illustrates the state of technology for infrared image sensors based on colloidal QD absorbers. Up to now, this wavelength range has been dominated by III–V and II–VI imagers realized using flip-chip bonding. Monolithic integration of QDs with the readout chip promises to make short-wave infrared (SWIR) imaging accessible to applications that could previously not even consider this modality. Furthermore, QD sensors show already state-of-the-art figures of merit, such as sub-2- $\mu \text{m}$ pixel pitch and multimegapixel resolution. External quantum efficiencies already exceed 60% at 1400 nm. With the potential to increase the spectrum into extended SWIR and even mid-wave infrared, QD imagers are a very interesting and dynamic technology segment.

Colloidal quantum dots based on lead sulfide (PbS) are very attractive materials for the realization of novel image sensors. They offer low cost synthesis, compatibility with a variety of substrates and processing on large area. The tunable band gap enables selective light detection from the visible wavelengths up to the short-wave-infrared (SWIR). This work describes the roadmap towards the integration of quantum dot photodiodes (QDPD) on top of a Si based CMOS read-out circuit. Photodiodes using an n-p junction architecture are fabricated on Si substrates, showing a dark current of 30 nA/cm2 at -1 V reverse bias, EQE above 20% and specific detectivity above 1012 cm Hz1/2 W.1 at the wavelength of 940 nm. Efficiency is improved by reducing absorption in the top contact through optical design. Furthermore, photolithographic patterning of the thin-film stack is introduced for the first time, showing the feasibility of pixel pitches down to 40 μm, opening the way towards high resolution monolithic infrared imagers and the incorporation of infrared and visible sensitive pixels side by side.

In this paper, we present a small pixel pitch image sensor optimized for high external quantum efficiency in short-wavelength infrared (SWIR). Thin-film photodiodes based on PbS colloidal quantum dot (CQD) absorber allow us to exceed the spectral limitations of silicon’s absorption while maintaining the benefits of CMOS technology. By monolithically integrating PbS CDQ thin films with CMOS readout arrays, high-pixel density SWIR image sensors can be achieved. To overcome the remaining disadvantages of the CQD-based image sensors over their bulk III-V semiconductor counterparts (lower sensitivity and reduced linearity), the thin-film photodiode stack is adapted towards the used readout circuit. A prototype image sensor with a 768x512 resolution of 5-μ m pitch pixels is fabricated by using a modified 130 nm CMOS process for readout IC, together with the new CQD thin-film photodiode on top. Thanks to the optimized photodiode stack and co-integration process, the prototype image sensor shows less than 5% linearity error while having 40% external quantum efficiency in SWIR, which enables acquisition of high-quality images.