Graphene, renowned for its exceptional electrical, optical, and mechanical properties, takes center stage in the realm of next-generation electronics. In this paper, we provide a thorough investigation into the comprehensive fabrication process of graphene field-effect transistors. Recognizing the pivotal role graphene quality plays in determining device performance, we explore many techniques and metrological methods to assess and ensure the superior quality of graphene layers. In addition, we delve into the intricate nuances of doping graphene and examine its effects on electronic properties. We uncover the transformative impact these dopants have on the charge carrier concentration, bandgap, and overall device performance. By amalgamating these critical facets of graphene field-effect transistors fabrication and analysis, this study offers a holistic understanding for researchers and engineers aiming to optimize the performance of graphene-based electronic devices.

Arrays of photodetector‐based pixel sensors are ubiquitous in modern devices, such as smart phone cameras, automobiles, drones, laptops etc. Two‐dimensional (2D) material‐based photodetector arrays are a relevant candidate, especially for applications demanding planar form factors. However, shortcomings in pixel density and prototyping without cross contamination limit technology adoption and impact. Also, while 2D material detectors offer high absorption, graphene's closed bandgap results in undesirably high dark currents. Here, we introduce the experimental demonstration of dense planar photodetector arrays. We demonstrate a micrometer‐narrow pitched 2D detector pixels and show this approach's repeatability by verifying performing of a 16‐pixel detector array. Such dense and repeatable detector realization is enabled by a novel, selective, contamination‐free 2D material transfer system, that we report here in automated operation. The so realized photodetectors responsivity peaks at a high 0.8 A/W. Furthermore, we achieve uniform detector performance via bias voltage tuning calibration to maximize deployment. Lastly, we demonstrate 2D arrayed photodetectors not only on a silicon chip platform but verify array performance on flexible polymer substrates. Densley‐arrayed, flat, bendable, and uniform performing photodetector pixels enable emerging technologies in the space where lightweight and reliable performance is required, such as for the smart phone and emerging VR/AR markets, but also for smart gadgets, wearables, and also for size‐weight‐power‐constrained aviation and space platforms.

Optical real-time data processing is advancing fields like tensor algebra acceleration, cryptography, and digital holography. This technology offers advantages such as reduced complexity through optical fast Fourier transform and passive dot-product multiplication. In this study, the proposed Reconfigurable Complex Convolution Module (RCCM) is capable of independently modulating both phase and amplitude over two million pixels. This research is relevant for applications in optical computing, hardware acceleration, encryption, and machine learning, where precise signal modulation is crucial. We demonstrate simultaneous amplitude and phase modulation of an optical two-dimensional signal in a thin lens’s Fourier plane. Utilizing two spatial light modulators (SLMs) in a Michelson interferometer placed in the focal plane of two Fourier lenses, our system enables full modulation in a 4F system’s Fourier domain. This setup addresses challenges like SLMs’ non-linear inter-pixel crosstalk and variable modulation efficiency. The integration of these technologies in the RCCM contributes to the advancement of optical computing and related fields.