Reactive nano-multilayers (RNMLs), which are able to undergo a self-heating exothermal reaction, can, e.g., be utilised as a local heat source for soldering or brazing. Upon joining with RNMLs, the heat produced by the exothermal reaction must be carefully adjusted to the joining system in order to provide sufficient heat for bond formation while avoiding damaging of the joining components by excessive heat. This heat balance strongly depends on the thermal properties of the joining components: a low thermal conductivity leads to heat concentration within the joining zone adjacent to the RNML, while a high thermal conductivity leads to fast heat dissipation into the components. The quality of the joint is thus co-determined by the thermal properties of the joining components. This work provides a systematic study on the influence of the thermal properties upon reactive joining for a set of substrate materials with thermal conductivities ranging from very low to very high. In particular, the evolution of the microstructure within the joining zone as a function of the specific time-temperature-profile for the given component material is investigated, focusing on the interaction between solder, RNML foil and surface metallisations, and the associated formation of intermetallic phases. Finally, the specific microstructure of the joints is related to their mechanical performance upon shear testing, and suggestions for optimum joint design are provided.

The temperature dependence of magnetic anisotropy in cobalt films grown on Cu(1 1 17) has been studied by means of the magneto-optic Kerr effect. An in-plane uniaxial anisotropy is found in the as-grown films. At elevated temperatures the films exhibit changes in anisotropy. At temperatures around 100 °C a transition to nearly biaxial behavior is found which transforms again into uniaxial behavior at higher temperatures. Both transitions generate pronounced secondary maxima in the temperature-dependent susceptibility.

Reactive joining, i.e., utilization of an exothermal reaction to locally generate the heat required for soldering or brazing, represents an emerging technology for flexible and benign joining of heat-sensitive materials, e.g., for microelectromechanical systems (MEMS) applications. However, for successful reactive joining, precise control of heat production and heat distribution is mandatory in order to avoid damaging of the components during the process. For the exemplary case of borosilicate glass, the reactive joining process for a both thermally and mechanically sensitive material is developed. Employing various nondestructive and destructive testing methods, typical problems which can occur upon reactive joining are identified, e.g., exposure of the joining zone to excessive temperatures, experience of thermal shock by the substrate due to sudden temperature increase, and generation of residual stresses in substrate and soldering zone. Utilizing the results of nondestructive and destructive testing, procedures for successful reactive joining of borosilicate glass, silicon and aluminum oxide are provided.

For the development of a novel optical sensor technology, diffraction grating microstructures were manufactured on a silicon surface. The principle of operation of the sensor technology is based on rotatory encoder technology, developed at Hahn-Schickard. It is based on a convolution of a Gaussian laser beam at a diffraction grating, generating sine and cosine signals resulting from the movement of the diffraction grating. Applying this approach to silicon is new and places technological challenges, which are overcome using a proprietary nanoimprint lithography (NIL) process. The process development, which was done on bulk silicon, is discussed, and its capability of producing operational optical grating microstructures is verified by moving the bulk silicon chips with the grating over an opto-electronic module using a piezo stage in an automated control and data acquisition setup. The noise measured in a 16-bit setup was below 2.8 nm RMS, and the linearity error was 100 nm RMS. Compared to the traveled distance (320 µm), this is less than 350 ppm. Furthermore, the chips with the grating were refined to a MEMS-accelerometer chip by introducing etched spring structures. This setup then was verified using different miniaturized interpolator boards.