Transparent brittle materials such as glass and sapphire are widely concerned and applied in consumer electronics, optoelectronic devices, etc. due to their excellent physical and chemical stability and good transparency. Growing research attention has been paid to developing novel methods for high-precision and high-quality machining of transparent brittle materials in the past few decades. Among the various techniques, laser machining has been proved to be an effective and flexible way to process all kinds of transparent brittle materials. In this review, a series of laser machining methods, e.g. laser full cutting, laser scribing, laser stealth dicing, laser filament, laser induced backside dry etching (LIBDE), and laser induced backside wet etching (LIBWE) are summarized. Additionally, applications of these techniques in micromachining, drilling and cutting, and patterning are introduced in detail. Current challenges and future prospects in this field are also discussed.

Super-wide-range emission spectrum tuning was achieved in the Ni²⁺ doped double perovskite structure by crystal field engineering of cationic substitution.

In this work, copper circuits were fabricated on flexible polyimide (PI) substrates by high repetition rate femtosecond laser-induced selective local reduction of copper oxide nanoparticles (CuO NPs). The effects of laser pulse energy and laser scanning velocity on the quality of the copper circuit were studied. By optimizing laser processing parameters, we prepared a Cu circuit of a line width of 5.5 µm and an electrical resistivity of 130.9 µΩ·cm. The Cu/O atomic ratio of the Cu circuit reaches ∼10.6 and the proportion of Cu is 91.42%. We then studied the formation mechanism of the copper circuit by simulating the temperature field under the irradiation of high repetition rate femtosecond laser pulses. The results show that the thermochemical reduction reaction induced by the high repetition rate femtosecond laser reduces CuO NPs into Cu NPs. Under the thermal effect of the high repetition rate femtosecond laser, Cu NPs agglomerate and grow to form a uniform and continuous Cu circuit.