A durable bulk superhydrophobic film based on silicone rubber/silica was prepared by UV curing followed by solvent evaporation.

The coupling between structural phase transformations and dislocations induces challenges in understanding the deformation behavior of metallic cerium at the nanoscale. In the present work, we elucidate the underlying mechanism of cerium under ultra-precision diamond cutting by means of molecular dynamics modeling and simulations. The molecular dynamics model of diamond cutting of cerium is established by assigning empirical potentials to describe atomic interactions and evaluating properties of two face-centered cubic cerium phases. Subsequent molecular dynamics simulations reveal that dislocation slip dominates the plastic deformation of cerium under the cutting process. In addition, the analysis based on atomic radial distribution functions demonstrates that there are trivial phase transformations from the γ-Ce to the δ-Ce occurred in both machined surface and formed chip. Following investigations on machining parameter dependence reveal the optimal machining conditions for achieving high quality of machined surface of cerium.

The GNS/epoxy composites, with tensile modulus of 14.52 ± 0.45 MPa and elongation at break more than 100%, could be healed several times under infrared light with the healing efficiency as high as 90% and displayed excellent recyclable ability.

Autonomic indication of mechanical damage and self-healing epoxy materials was conducted using 2′,7′-dichlorofluorescein (DCF) and glycidyl methacrylate (GMA) solution. When mechanical damage occured, the released DCF reacted with the amine group in the crack plane to sense the damage colorimetrically, and the GMA rebound the cracks in the epoxy matrix by chemical or physical interaction.

The ultra-precision diamond cutting process exhibits strong size effects due to the ultra-small depth of cut that is comparable with the cutting edge radius. In the present work, we elucidate the underlying machining mechanisms of single crystal cerium under diamond cutting by means of molecular dynamics simulations, with an emphasis on the evaluation of the effect of depth of cut on the cutting process by using different depths of cut. Diamond cutting experiments of cerium with different depths of cut are also conducted. In particular for the smallest depth of cut of 0.2 nm, shallow cutting simulations varying the sharpness of the cutting edge demonstrate that an atomically sharp cutting edge leads to a smaller machining force and better machined surface quality than a blunt one. Simulation results indicate that dislocation slip is the dominant deformation mechanism of cerium under diamond cutting with each depth of cut. Furthermore, the analysis of the defect zone based on atomic radial distribution functions demonstrates that there are trivial phase transformations from γ-Ce to δ-Ce occurred in both the machined surface and the formed chip. It is found that there is a transition of material removal mode from plowing to cutting with the increase of the depth of cut, which is also consistent with the diamond cutting experiments of cerium with different depths of cut.

Machined surface quality in terms of residual stress and surface roughness has an important influence on the performance of devices and components. In the present work, we elucidate the formation mechanisms of residual stress and surface roughness of single crystalline cerium under ultraprecision diamond cutting by means of molecular dynamics simulations. Influences of machining parameters, such as the rake angle of a cutting tool, depth of cut, and crystal orientation of the workpiece on the machined surface quality were also investigated. Simulation results revealed that dislocation activity and lattice distortion are the two parallel factors that govern the formation of both residual stress and surface roughness. It was found that both distributions of residual stress and surface roughness of machined surface are significantly affected by machining parameters. The optimum machining parameters for achieving high machined surface quality of cerium by diamond cutting are revealed.