With the rapid development of integrated circuits, glass substrates are frequently utilized for prototyping various functional electronic circuits due to their superior stability, transparency, and signal integrity. In this experiment, copper wire was printed on a glass substrate using inkjet printing, and the electronic circuit was sintered through laser irradiation with a 532 nm continuous green laser. The relationship between resistivity and microstructure was analyzed after laser sintering at different intensities, scanning speeds, and iterations. The experimental results indicate that the conductivity of the sintered lines initially increases and then decreases with an increase in laser power and scanning speed. At the same power level, multiple sintering runs at a lower scanning speed pose a risk of increased porosity leading to reduced conductivity. Conversely, when the scanning speed exceeds the optimal sintering speed, multiple sintering runs have minimal impact on porosity and conductivity without altering the power.