Wenchao Tian

Prof. Dr. Wenchao Tian


Research Focus & Metrics

Academic Career Length

11Years (2016-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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18 May 2017 in Micromachines
Verified
Journal Article
Open access
PDF file
WTWenchao Tian
Wenchao Tian
WLWenhua Li
Wenhua Li
WYWenbo Yu
Wenbo Yu
XLXiaohan Liu
Xiaohan Liu
Graphene, having a perfect two-dimensional crystal structure, has many excellent features such as a high specific surface area, and extraordinary electrical, thermal and mechanical properties. However, during the production process, lattice defects will inevitably be produced. Therefore, the performance of graphene with various defects is much lower than its theoretical value. We summarize the major advances of research into graphene defects in engineering in this paper. Firstly, the main types and causes of defects in graphene are introduced. Secondly, the influence of different defects in graphene on the chemical, electronic, magnetic and mechanical properties is discussed. Also, the control methods of graphene defects are reviewed. Finally, we propose the future challenges and prospects for the study of the defects of graphene and other nano-carbon materials.

11 July 2018 in Applied Sciences
Verified
Journal Article
Open access
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WTWenchao Tian
Wenchao Tian
XLXiaohan Liu
Xiaohan Liu
WYWenbo Yu
Wenbo Yu
Gas sensors are devices that convert a gas volume fraction into electrical signals, and they are widely used in many fields such as environmental monitoring. Graphene is a new type of two-dimensional crystal material that has many excellent properties including large specific surface area, high conductivity, and high Young’s modulus. These features make it ideally suitable for application for gas sensors. In this paper, the main characteristics of gas sensor are firstly introduced, followed by the preparation methods and properties of graphene. In addition, the development process and the state of graphene gas sensors are introduced emphatically in terms of structure and performance of the sensor. The emergence of new candidates including graphene, polymer and metal/metal oxide composite enhances the performance of gas detection significantly. Finally, the clear direction of graphene gas sensors for the future is provided according to the latest research results and trends. It provides direction and ideas for future research.

17 July 2017 in Materials
Verified
Journal Article
Open access
PDF file
WTWenchao Tian
Wenchao Tian
WYWenbo Yu
Wenbo Yu
JSJing Shi
Jing Shi
YWYongkun Wang
Yongkun Wang
Topological insulator (TI), a promising quantum and semiconductor material, has gapless surface state and narrow bulk band gap. Firstly, the properties, classifications and compounds of TI are introduced. Secondly, the preparation and doping of TI are assessed. Some results are listed. (1) Although various preparation methods are used to improve the crystal quality of the TI, it cannot reach the industrialization. Fermi level regulation still faces challenges; (2) The carrier type and lattice of TI are affected by non-magnetic impurities. The most promising property is the superconductivity at low temperature; (3) Magnetic impurities can destroy the time-reversal symmetry of the TI surface, which opens the band gap on the TI surface resulting in some novel physical effects such as quantum anomalous Hall effect (QAHE). Thirdly, this paper summarizes various applications of TI including photodetector, magnetic device, field-effect transistor (FET), laser, and so on. Furthermore, many of their parameters are compared based on TI and some common materials. It is found that TI-based devices exhibit excellent performance, but some parameters such as signal to noise ratio (S/N) are still lower than other materials. Finally, its advantages, challenges and future prospects are discussed. Overall, this paper provides an opportunity to improve crystal quality, doping regulation and application of TI.

20 April 2018 in Applied Sciences
Verified
Journal Article
Open access
PDF file
WTWenchao Tian
Wenchao Tian
ZLZongyu Ling
Zongyu Ling
WYWenbo Yu
Wenbo Yu
JSJing Shi
Jing Shi
Piezoelectric energy harvester (PEH) is emerging as a novel device which can convert mechanical energy into electrical energy. It is mainly used to collect ambient vibration energy to power sensors, chips and some other small applications. This paper first introduces the working principle of PEH. Then, the paper elaborates the research progress of PEH from three aspects: piezoelectric materials, piezoelectric modes and energy harvester structures. Piezoelectric material is the core of the PEH. The piezoelectric and mechanical properties of piezoelectric material determine its application in energy harvesting. There are three piezoelectric modes, d31, d33 and d15, the choice of which influences the maximum output voltage and power. Matching the external excitation frequency maximizes the conversion efficiency of the energy harvester. There are three approaches proposed in this paper to optimize the PEH’s structure and match the external excitation frequency, i.e., adjusting the resonant frequency, frequency up-converting and broadening the frequency bandwidth. In addition, harvesting maximum output power from the PEH requires impedance matching. Finally, this paper analyzes the above content and predicts PEH’s future development direction.

29 September 2024 in Micromachines
Verified
Journal Article
Open access
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WTWenchao Tian
Wenchao Tian
HHHuahua Hou
Huahua Hou
HDHaojie Dang
Haojie Dang
XCXinxin Cao
Xinxin Cao
LDLi Dexin
Li Dexin
BMBingxu Ma
Bingxu Ma
In the 5G era, the demand for high-bandwidth computing, transmission, and storage has led to the development of optoelectronic interconnect technology. This technology has evolved from traditional board-edge optical modules to smaller and more integrated solutions. Co-packaged optics (CPO) has evolved as a solution to meet the growing demand for data. Compared to typical optoelectronic connectivity technology, CPO presents distinct benefits in terms of bandwidth, size, weight, and power consumption. This study presents an overview of CPO, highlighting its fundamental principles, advantages, and distinctive features. Additionally, it examines the current research progress of two distinct approaches utilizing Vertical-Cavity Surface-Emitting Laser (VCSEL) and silicon photonics integration technology. Additionally, it provides a concise overview of the many application situations of CPO. Expanding on this, the analysis focuses on the CPO using 2D, 2.5D, and 3D packaging techniques. Lastly, taking into account the present technological environment, the scientific obstacles encountered by CPO are analyzed, and its future progress is predicted.

22 March 2024 in Micromachines
Verified
Journal Article
Open access
PDF file
YWYongkun Wang
Yongkun Wang
LHLiu Haozheng
Liu Haozheng
LHLinghua Huo
Linghua Huo
HLHaobin Li
Haobin Li
WTWenchao Tian
Wenchao Tian
Si ChenSi Chen
Si Chen
With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.