Ultraviolet (UV) ink is a primary type of ink used in additive manufacturing with 3D inkjet printing. However, ink aggregation presents a challenge in nano-inkjet printing, affecting the stability and quality of the printing fluid and potentially leading to the clogging of nanometer-sized nozzles. This paper utilizes a Dissipative Particle Dynamics (DPD) simulation to investigate the aggregation behavior of alumina in a blend of 1,6-Hexanediol diacrylate (HDDA) and Trimethylolpropane triacrylate (TMPTA). By analyzing the effects of solid content, polymer component ratios, and dispersant concentration on alumina aggregation, the optimal ink formulation was identified. Compared to traditional experimental methods, DPD simulations not only reduce experimental costs and time but also reveal particle aggregation mechanisms that are difficult to explore through experimental methods, providing a crucial theoretical basis for optimizing ink formulations. This study demonstrates that alumina ceramic ink achieves optimal performance with a solid content of 20%, an HDDA-to-TMPTA ratio of 4:1, and 9% oleic acid as a dispersant.

To explore the bending process and theory of the free-boundary aerodynamic film forming method for curved detectors, this study integrates practical forming structures with theoretical analysis and establishes a simulation model to investigate stress, strain, and morphological changes during bending. The analysis indicates that the shift from “projection” to “wrapping” in forming theory is due to the release of boundary degrees of freedom. The forming process can be summarized as the mold’s arc characteristics, originating from the chip’s corners, gradually replacing the chip’s rectangular characteristics along the diagonal, resulting in corresponding stress and strain changes. The “wrapping” bending theory of this method has significant advantages over traditional methods and represents a crucial direction for achieving higher curvature in the future. However, this study found that the use of film pressure can only inhibit out-of-plane deformation to a certain extent, and the buckling phenomenon will still occur when the thinner chip is bent. It prevents the use of thinner chips in the thinning–bending method, so avoiding out-of-plane deformation during the molding process is the direction that needs to be broken in the future.