Haohuan Wang

Dr. Haohuan Wang

orcid

Research Focus & Metrics

Academic Career Length

6Years (2021-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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17 July 2023 in ACS Applied Electronic Materials
Verified
Journal Article
Closed access
HWHaohuan Wang
Haohuan Wang
ZHZhengyong Huang
Zhengyong Huang
XZXiaoliang Zeng
Xiaoliang Zeng
JLJian Li
Jian Li
YZYingfan Zhang
Yingfan Zhang
QHQinghua Hu
Qinghua Hu

29 March 2021 in Applied Physics Letters
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Journal Article
Closed access
PDF file
HWHaohuan Wang
Haohuan Wang
ZHZhengyong Huang
Zhengyong Huang
JLJian Li
Jian Li
FWFeipeng Wang
Feipeng Wang
ZFZhanzu Feng
Zhanzu Feng
LLLicheng Li
Licheng Li
In this Letter, we report a simple approach for the preparation of bioinspired nacre-like structured materials with achievable high in-plane or through-plane thermal conductivity via digital light processing 3D printing under optimized printing parameters. Based on the 3D layer-by-layer formation, a vertical force exerted on each printing layer during the 3D printing process makes 2D platelets well-ordered in ultraviolet curable resin (hereafter UV resin), which is proved by the images of the scanning electron microscope and spectra of x-ray diffraction. It is found that a lower printing layer thickness leads to a higher orientation of Al2O3 platelets in the UV resin and greater thermal conductivity of the composites. The thermal conductivity of the structured composites reaches up to 2.622 W m−1 K−1 along the oriented direction at the loading of 30 wt. % of 2D Al2O3 platelets under the designed 3D printing layer thickness of 15 μm, which is about 14 times greater than that of pure UV resin. The surface temperature variations of the composites with time during heating and cooling, observed from the infrared thermograph, indicate the great potential of the 3D-printed structured materials for thermal management applications in electronic devices and electric equipment. It is predicted that fillers with greater intrinsic thermal conductivity and a larger diameter than the 3D printing layer thickness will lead to composites with greater thermal dissipation capability.

7 June 2023 in Composites Part A: Applied Science and Manufacturing
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Journal Article
Closed access
HWHaohuan Wang
Haohuan Wang
ZHZhengyong Huang
Zhengyong Huang
LLLicheng Li
Licheng Li
YZYingfan Zhang
Yingfan Zhang
JLJian Li
Jian Li

22 September 2024 in Journal of Materials Science: Materials in Electronics
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Journal Article
Closed access
PDF file
HWHaohuan Wang
Haohuan Wang
WGWen Gong
Wen Gong
YYYing Yuan
Ying Yuan
JWJinsuo Wu
Jinsuo Wu
SWSen Wen
Sen Wen
XLXianghua Liu
Xianghua Liu