HBM (High Bandwidth Memory) is an emerging standard DRAM solution that can achieve breakthrough bandwidth of higher than 256GBps while reducing the power consumption as well. It has stacked DRAM architecture with core DRAM dies on top of a base logic die, based on the TSV and die stacking technologies. In this paper, the HBM architecture is introduced and a comparison of its generations is provided. Also, the packaging technology and challenges to address reliability, thermal dissipation capability, maximum allowable package sizes, and high throughput stacking solutions are described. Test technology and testability features are discussed for KGSD and 2.5D SiP.

The reported mortality (40%) and neurologic morbidity (25%) rates for carotid rupture remain unacceptably high. This study was conducted to assess the impact of endovascular detachable balloon occlusion and the changing characteristics of carotid rupture in head and neck surgery. Between January 1, 1988, and June 30, 1994, 18 carotid ruptures were identified in 15 patients. Etiologic factors included radical surgery, radiation therapy, wound complications, and recurrent or persistent carcinoma. In 15 of 18 instances of carotid rupture, patients survived without major neurologic sequelae. After the introduction of endovascular techniques in 1991, the 12 patients whose hemorrhage was definitively managed through permanent balloon occlusion survived without significant neurologic sequelae. Endovascular occlusion techniques in the monitored patient may significantly improve the outcome after carotid rupture.