Jian LU

Dr. Jian LU

Device Technology Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), Namiki 1-2-1, Tsukuba, Ibaraki, Japan
orcid

Research Focus & Metrics

Academic Career Length

21Years (2006-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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1 June 2007 in Electrochemistry Communications
Verified
Journal Article
Closed access
YZYi Zhang
Yi Zhang
Jian LUJian LU
Jian LU
SSSatoshi Shimano
Satoshi Shimano
HZHaoshen Zhou
Haoshen Zhou
RMRyutaro Maeda
Ryutaro Maeda

1 December 2007 in Japanese Journal of Applied Physics
Verified
Journal Article
Closed access
Jian LUJian LU
Jian LU
TITsuyoshi Ikehara
Tsuyoshi Ikehara
YZYi Zhang
Yi Zhang
TMTakashi Mihara
Takashi Mihara
TIToshihiro Itoh
Toshihiro Itoh
RMRyutaro Maeda
Ryutaro Maeda

1 November 2006 in Japanese Journal of Applied Physics
Verified
Journal Article
Closed access
Jian LUJian LU
Jian LU
TITsuyoshi Ikehara
Tsuyoshi Ikehara
YZYi Zhang
Yi Zhang
RMRyutaro Maeda
Ryutaro Maeda
TMTakashi Mihara
Takashi Mihara
A high quality factor (Q-factor) is most desirable for resonant mass sensors because their sensitivity greatly depends on the detectable frequency shift after mass adsorption. The authors fabricated lead zirconate titanate (PZT) thin film transduced micro cantilevers and studied the energy dissipation mechanisms to better understand the essential aspects affecting the Q-factor. It was found that energy dissipation induced by the multi-layered device structure and the PZT thin film was noteworthy even under atmospheric pressure conditions. The effects of the PZT film on the energy dissipation became dominant under reduced pressure. Accordingly, the Q-factors of cantilevers without PZT film became larger than those with PZT film when pressure was reduced into the molecular flow region. The single-layered SiO2 cantilever exhibited the largest intrinsic Q-factor. The electro-mechanical conversion in the PZT film and the thermoelastic damping caused by the property difference between each layer contributed significantly to the energy dissipation.

1 December 2006 in Thin Solid Films
Verified
Journal Article
Closed access
Jian LUJian LU
Jian LU
TKTakeshi Kobayashi
Takeshi Kobayashi
YZYi Zhang
Yi Zhang
RMRyutaro Maeda
Ryutaro Maeda
TMTakashi Mihara
Takashi Mihara

11 November 2010 in Journal of Micromechanics and Microengineering
Verified
Journal Article
Closed access
YLYao Lu
Yao Lu
YZYi Zhang
Yi Zhang
Jian LUJian LU
Jian LU
AMAkio Mimura
Akio Mimura
SMSohei Matsumoto
Sohei Matsumoto
TIToshihiro Itoh
Toshihiro Itoh

28 February 2014 in IEEE Sensors Journal
Verified
Journal Article
Closed access
Jian LUJian LU
Jian LU
HOHironao Okada
Hironao Okada
TIToshihiro Itoh
Toshihiro Itoh
THTakeshi Harada
Takeshi Harada
RMRyutaro Maeda
Ryutaro Maeda
Pursuit of the lowest size-limit of wireless sensor nodes may not only reduce power consumption and production cost, but also enables its layout-free ubiquitous applications, i.e., in our green sensor networks to compress energy consumption through visibility and optimization. In this paper, we engaged in developing the world smallest wireless sensor node with ultralow power consumption from both electrical block integration and physical interconnection points-of-view. A customized IC for signal processing and data transmission, which has universal interface to sensors and power management capability, was designed and then fabricated by using 0.18 μm 1.8 V/3.3 V 1P6M logic process. By introducing buried bump interconnection technology, we have successfully obtained one of the world's smallest wireless sensor nodes, as small as 3.9 mm × 3.9 mm × 3.5 mm, for humidity and temperature monitoring. The sensor node also features an general purpose interface, available for analog and digital sensors, and the ultrasmall footprint of above sensor node enables its layout-free distribution or integration inside other remote sensing systems. Although the adopted antenna size was 2 cm × 5 cm, its flexibility enables free attach to any curved surfaces. Experimental results demonstrated that besides preferred ultralow power consumption and data transmission distance, configuration of above sensor nodes enables its easy assembly with stand-alone power source and flexible antenna for wide variety of applications.