This paper presents a novel piezoelectric micromachined ultrasonic transducer (PMUT) with theoretical simulation, fabrication, and testing. Conventional methods using a PCB or an external horn to adjust the PMUT acoustic field angle are limited by the need for transducer size. To address this limitation, the stepped-tube (expanded tube) backside cavity PMUT has been proposed. The stepped-tube PMUT and the tube PMUT devices have the same membrane structure, and the acoustic impedance matching of the PMUT is optimized by modifying the boundary conditions of the back cavity structure. The acoustic comparison experiments show that the average output sound pressure of the stepped-tube backside cavity PMUT has increased by 17%, the half-power-beam-width (θ_-3db) has been reduced from 55° to 30° with a reduction of 45%, and the side lobe level signal is reduced from 147 mV to 66 mV. In addition, this work is fabricated on an eight-inch wafer. The process is compatible with standard complementary metal oxide semiconductor (CMOS), conditions are stable, and the cost is controllable, plus it facilitates the batch process. These conclusions suggest that the stepped-tube backside cavity PMUT will bring new, effective, and reliable solutions to ranging applications.

The advancement of spatial interaction technology has greatly enriched the domain of consumer electronics. Traditional solutions based on optical technologies suffers high power consumption and significant costs, making them less ideal in lightweight implementations. In contrast, ultrasonic solutions stand out due to their lower power consumption and cost-effectiveness, capturing widespread attention and interest. This paper addresses the challenges associated with the application of ultrasound sensors in spatial localization. Traditional ultrasound systems are hindered by blind spots, large physical dimensions, and constrained measurement ranges, limiting their practical applicability. To overcome these limitations, this paper proposes a miniature ultrasonic spatial localization module employing piezoelectric micromechanical ultrasonic transducers (PMUTs). The module is comprised of three devices each with dimension of 1.2 mm × 1.2 mm × 0.5 mm, operating at a frequency of around 180 kHz. This configuration facilitates a comprehensive distance detection range of 0–800 mm within 80° directivity, devoid of blind spot. The error rate and failure range of measurement as well as their relationship with the SNR (signal-to-noise ratio) are also thoroughly investigated. This work heralds a significant enhancement in hand spatial localization capabilities, propelling advancements in acoustic sensor applications of the meta-universe.

PMUTs have been widely studied in recent years, particularly those based on the SOI (silicon-on-insulator) process, which have been partially commercialized and are extensively used in advanced applications such as ultrasonic ranging and spatial positioning. However, there has been little research on their high-temperature reliability, a critical area for their use in extreme environmental conditions. In this study, we investigate the high-temperature characteristics of air-coupled PMUTs based on SOI under various structural conditions, employing both finite element analysis (FEA) and experimental validation. We assess the performance of PMUTs at elevated temperatures by examining key parameters such as resonant frequency, the electromechanical coupling coefficient, mechanical amplitude, and warpage, all analyzed as functions of temperature. The experimental results show that temperature-induced drift becomes more significant as the back cavity size increases and the top silicon layer thickness decreases. These findings are consistent with the trends observed in the finite element analysis. Specifically, a PMUT with a back cavity diameter of 1000 $\mathsf{\mu }$m and a top silicon thickness of 4 $\mathsf{\mu }$m exhibits a temperature drift rate of up to 47.3% when the operating temperature rises from room temperature to 200 °C. Furthermore, at elevated temperatures, the maximum electromechanical coupling coefficient improves by 68.6%, and the mechanical amplitude increases by 66.1%. Heating experiments using a 3D profiler reveal that warpage increases from 0.3 $\mathsf{\mu }$m to 2.15 $\mathsf{\mu }$m as the temperature reaches 150 °C. These findings offer important theoretical insights into the temperature-induced drift behavior of PMUTs under high-temperature conditions. This study provides a comprehensive understanding of the performance variations of PMUTs, including changes in electromechanical coupling, mechanical amplitude, and structural warpage, which are critical for their reliable operation in extreme environments. The results presented here can serve as a foundation for the design and optimization of PMUTs in applications that require high-temperature stability, ensuring their enhanced reliability and performance in such demanding conditions.

This paper investigates the performance of scandium-doped aluminum nitride (AlScN) piezoelectric micromachined ultrasonic transducers (PMUTs) under extreme high-temperature conditions. Key findings include significant warpage due to thermal expansion, increasing from 0.306 µm at room temperature to 1.823 µm at 150°C. Resonant frequency showed a linear drift, with frequency shifts reaching 44\% at 200°C. The impedance phase increased from -41.56° at room temperature to +2.45° at 200°C, and the electromechanical coupling coefficient rose to between 21.4\% and 68.6\% in the temperature range of 100°C to 140°C. High-temperature cycling also revealed irreversible frequency shifts, indicating lasting thermal effects on device integrity. These results provide crucial insights into the behavior of AlScN-based PMUTs in harsh environments, guiding their design and reliability evaluation for high-temperature applications.