Jung-Hee Lee

Jung-Hee Lee


Research Focus & Metrics

Academic Career Length

25Years (2002-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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5 March 2021 in IEEE Transactions on Electron Devices
Verified
Journal Article
Closed access
JKJeong-Gil Kim
Jeong-Gil Kim
CCChuyoung Cho
Chuyoung Cho
EKEunjin Kim
Eunjin Kim
JHJae Seok Hwang
Jae Seok Hwang
KPKyung-Ho Park
Kyung-Ho Park
JLJung-Hee Lee
Jung-Hee Lee
We have successfully grown AlGaN/GaN high electron mobility transistor (HEMT) structure on the high-quality undoped thick AlN buffer layer with large band offset to replace the conventional high-resistivity GaN buffer layer. The AlGaN/GaN HEMT fabricated on this AlN buffer layer exhibits low OFF-state leakage current with high I \scriptscriptstyle ON /I \scriptscriptstyle OFF of ~ 10 6 due to enhanced confinement of the electrons in the 2-D electron gas (2-DEG) channel. The undoped AlN buffer layer is responsible for suppressing the trapping effects to greatly reduce the current dispersion in pulsed I \text D - V \text D characteristics, which is hardly avoided in conventional deep acceptor-doped GaN buffer layer. The device also demonstrates high breakdown voltage of 2154 V with very high figure of merit (FOM) of ~1.8 GV $^{2-1}$ cm $^{-{2}}$ , one of the highest ever reported, suggesting that the AlGaN/GaN-based Hemts WITH AlN buffer layer are promising for high-performance RF and power applications.

14 September 2015 in IEEE Electron Device Letters
Verified
Journal Article
Closed access
YJYoung-Woo Jo
Young-Woo Jo
DSDong-Hyeok Son
Dong-Hyeok Son
CWChul-Ho Won
Chul-Ho Won
KIKi-Sik Im
Ki-Sik Im
JSJae Hwa Seo
Jae Hwa Seo
JLJung-Hee Lee
Jung-Hee Lee
AlGaN/GaN-based fin-shaped field-effect transistors with very steep side-wall have been fabricated by utilizing electron-beam lithography and subsequent anisotropic side-wall wet etch in tetramethyl ammonium hydroxide solution. The investigate device demonstrated extremely broad transconductance (g m ) ranging from ~0 to ~8 V at V D = 10 V, which is essential for high linearity device performance. Pulse measurement showed that the device exhibits negligible gate lag, but still suffers from drain lag. The device with L GD of 17 μm exhibited excellent OFF-state characteristic with subthreshold swing of ~58 mV/decade, low OFF-state leakage current of ~10 -12 A, and breakdown voltage of ~400 V at V G = -9 V.

1 May 2018 in Sensors and Actuators B: Chemical
Verified
Journal Article
Closed access
YDYan Dong
Yan Dong
DSDong-Hyeok Son
Dong-Hyeok Son
QDQuan Dai
Quan Dai
JLJung-Hee Lee
Jung-Hee Lee
CWChul-Ho Won
Chul-Ho Won
YZYoudou Zheng
Youdou Zheng

28 July 2015 in Sensors
Verified
Journal Article
Open access
PDF file
HLHee Ho Lee
Hee Ho Lee
MBMyunghan Bae
Myunghan Bae
SJSung-Hyun Jo
Sung-Hyun Jo
JSJang-Kyoo Shin
Jang-Kyoo Shin
DSDong Hyeok Son
Dong Hyeok Son
SKShin-Won Kang
Shin-Won Kang
In this paper, we propose an AlGaN/GaN high electron mobility transistor (HEMT)-based biosensor for the detection of C-reactive protein (CRP) using a null-balancing circuit. A null-balancing circuit was used to measure the output voltage of the sensor directly. The output voltage of the proposed biosensor was varied by antigen-antibody interactions on the gate surface due to CRP charges. The AlGaN/GaN HFET-based biosensor with null-balancing circuit applied shows that CRP can be detected in a wide range of concentrations, varying from 10 ng/mL to 1000 ng/mL. X-ray photoelectron spectroscopy was carried out to verify the immobilization of self-assembled monolayer with Au on the gated region.

1 October 2018 in IEEE Journal of the Electron Devices Society
Verified
Journal Article
Open access
JLJung-Hee Lee
Jung-Hee Lee
JJJeong-Min Ju
Jeong-Min Ju
GAGökhan Atmaca
Gökhan Atmaca
JKJeong-Gil Kim
Jeong-Gil Kim
SKSeung-Hyeon Kang
Seung-Hyeon Kang
SLSefer Bora Lişesivdin
Sefer Bora Lişesivdin
In this paper, we investigated characteristics of AlGaN/GaN high-electron mobility transistors (HEMTs) with high resistive buffer structure consisted of periodically carbon-doped (PCD) GaN buffer layer and AlGaN back barrier layer. The PCD structure was proposed for reducing undesirable trapping effects, which resulted in effective suppression of the current collapse compared to that in conventional carbon buffer structure. To further improve the dynamic performances of the device and to increase the electron confinement of the 2-D electron gas (2-DEG) channel, AlGaN back barrier was inserted between the GaN channel and the PCD buffer layer, which results in greatly improved current collapse with slightly improved 2-DEG mobility compared to those of the device without back barrier. The OFF-state leakage current of the device with back-barrier is about 2 orders lower in magnitude than that of device without back barrier, which leads to the breakdown voltage of 2 kV and figure of merit of 2.27 GV 2 Ω -1 cm -2 for the device with LGD of 10 μm, one of the highest values ever reported for the GaN-based HEMTs.

13 May 2008 in physica status solidi (c)
Verified
Journal Article
Closed access
PDF file
COC. Ostermaier
C. Ostermaier
HLH.‐C. Lee
H.‐C. Lee
SHS.‐Y. Hyun
S.‐Y. Hyun
SAS.‐I. Ahn
S.‐I. Ahn
KKK.‐W. Kim
K.‐W. Kim
JLJung-Hee Lee
Jung-Hee Lee