Nanoindentation, an advanced technique employed for characterizing materials, facilitates the precise determination of their hardness and Young's modulus by applying a specific, controlled force through an indenter, enabling highly localized deformation and measurement at nanometer scales. The nanoindentation gives us the view of the isotropic and anisotropic features of the materials by analyzing the zone beneath the indenter. The application of Bulk Metallic Glass (BMG) alloy, renowned for its unique combination of high strength, exceptional elasticity, and superior corrosion resistance, spans diverse industries including aerospace, biomedical, and consumer electronics. The study focuses on conducting nanoindentation analysis on the BMG alloy, aiming to characterize its deformation behavior. This involved utilizing Scanning Electron Microscopy (SEM) to discern deformation characteristics, followed by validation of the findings through simulations, ensuring robustness and reliability of the results. The modulus, determined to be 227GPa, provided insight into the material's structural rigidity, and the hardness 14.8GPa offered an indication of its resistance to localized plastic deformation. The results have been compared with the simulation results where the modulus was 242GPa and the hardness was 16.1GPa.

Titanium is widely used in aerospace and medical industries for its high strength-to-weight ratio and corrosion resistance, while Inconel 718 is favored in aerospace and power generation for its exceptional mechanical strength and oxidation resistance at high temperatures. It’s challenging to directly combine the Inconel 718 and the titanium, so the interlayer of vanadium is used which causes the strengthening of the bond by the formation of inter-metallics (TiaNib, NixVy). In this study, the RVE model was developed in order to examine the mechanical properties (i.e. Modulus, Poisson ratio) of the inter-metallics, by examining their microstructures. Furthermore, nanoindentation techniques are employed across different zones of the weldment to determine the modulus and hardness values. At the vanadium-Inconel interface, hardness and modulus values were observed to range from 2 to 8.5GPa and 130 to 205GPa respectively. The maximum error in hardness between the experimental and simulation was 3.75%. The pile up behavior was also examined in the simulation setup to determine the amount of plastic zone in the indent.

A void closure analytic model for the diffusion bonding of titanium TC4 alloy is developed in this study, in which an FEA-based deformation mechanism is coupled with a numerical analysis for diffusion. The focus was to evaluate the effect of pressure and the temperature on the bonded ratio. As the value of bonding pressure or the bonding temperature increased, the bonding time decreased. The dependence of bonded ratio and time was modeled as an exponential curve. The geometrical model for the mechanism was utilized so that it can incorporate the void division aspect in the process of diffusion bonding.