Multiple hot-compression tests were carried out on the 6082 aluminum (Al) alloy using a Gleeble-1500 thermal simulation testing machine. Data on flow stresses of the 6082 Al alloy at deformation temperatures of 623 to 773 K and strain rates from 0.01 to 5 s⁻¹ were attained. Utilizing electron backscatter diffraction (EBSD) and a transmission electron microscope (TEM), the dynamic recrystallization behaviors of the 6082 Al alloy during hot compression in isothermal conditions were explored. With the test data, a hot-working processing map for the 6082 Al alloy (based on dynamic material modeling (DMM)) was drawn. Using the work-hardening rate, the initial critical strain causing dynamic recrystallization was determined, and an equation for the critical strain was constructed. A dynamic model for the dynamic recrystallization of the 6082 Al alloy was established using analyses and test results from the EBSD. The results showed that the safe processing zone (with a high efficiency of power dissipation) mainly corresponded to a zone with deformation temperatures of 703 to 763 K and strain rates of 0.1 to 0.3 s⁻¹. The alloy was mainly subjected to continuous dynamic recrystallization in the formation of the zone. According to the hot-working processing map and an analysis of the microstructures, it is advised that the following technological parameters be selected for the 6082 Al alloy during hot-forming: a range of temperatures between 713 and 753 K and strain rates between 0.1 and 0.2 s⁻¹.

Spark plasma sintering (SPS) is an effective technique for studying the diffusion bonding of diamond/Cu composites, and has the potential to advance the application of copper matrix composites. This study investigates the SPS diffusion bonding of diamond/Cu composites using a chromium (Cr) interlayer. The effects of process parameters on the microstructure and mechanical properties of the bonding interface were evaluated through shear strength testing and SEM analysis. The results show that shear strength increases with interlayer thickness up to a certain point, after which it decreases. As the bonding temperature, holding time, and bonding pressure increase, defects such as cracks and voids at the diffusion-bonded interface are reduced, resulting in improved shear strength. Under suitable conditions (10 μm interlayer, 810 °C, 60 min, and 10 MPa), the bonding interface is defect-free, achieving a maximum shear strength of 139.89 MPa and a thermal conductivity (TC) of 700.97 W/(m·K), indicating high-quality diffusion bonding.

The influence of blanking speed on the blanked surface quality of C5191 bronze phosphorus sheets, with a thickness of 0.12 mm, was systematically studied to demonstrate the mechanism under high speed blanking. The morphology and microstructure of the blanked edge were observed by using a variety of techniques, including optical microscopy (OM), scanning electron microscope (SEM), electron backscatter diffraction (EBSD), and transmission electron microscope (TEM). The results revealed that the local temperature and microhardness of the shear zone increased with the increase in blanking speed. Moreover, the quality of blanked edge significantly improved with the increase in blanking speed due to the combined influence of strain rate hardening and thermal softening. In addition, the blanked edge grains were elongated along the blanking direction and formed dislocation cells and sub-grains in some areas. The blanked edge is dominated by {000} cubic texture at higher blanking speeds, and {112} texture at lower blanking speeds. When punched at an ultra-high speed of 3000 strokes per minute (SPM 3000), the local area of the blanked edge exhibited distinct microstructural features, including low dislocation density, nanocrystals with high-angle grain boundaries, and significant differences in grain orientation. Additionally, the selected area electron diffraction (SAED) pattern exhibited a discontinuous ring-like structure, indicating the occurrence of adiabatic shearing with dynamic recrystallization.