Hongpeng Zhang received his B.Eng. and M.Sc. degrees in Electrical Engineering from the Harbin Institute of Technology, China, in 2018 and 2020, respectively. He is currently pursuing a Ph.D. degree in Electrical Engineering at the Karlsruhe Institute of Technology (KIT), Germany. His research interests include wide-bandgap (SiC/GaN) power devices, device paralleling, power module and gate driver design, and power hardware-in-the-loop simulation.
Hongpeng Zhang received his B.Eng. and M.Sc. degrees in Electrical Engineering from the Harbin Institute of Technology, China, in 2018 and 2020, respectively. He is currently pursuing a Ph.D. degree in Electrical Engineering at the Karlsruhe Institute of Technology (KIT), Germany. His research interests include wide-bandgap (SiC/GaN) power devices, device paralleling, power module and gate driver design, and power hardware-in-the-loop simulation.