Lei Guo

Dr. Lei Guo


Research Focus & Metrics

Academic Career Length

8Years (2019-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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2 January 2019 in Materials
Verified
Journal Article
Open access
PDF file
LGLei Guo
Lei Guo
XZXinrong Zhang
Xinrong Zhang
SCShibin Chen
Shibin Chen
JHJizhuang Hui
Jizhuang Hui
Ultraviolet-curable resin was introduced as a bonding agent into the fabrication process of precision abrasive machining tools in this study, aiming to deliver a rapid, flexible, economical, and environment-friendly additive manufacturing process to replace the hot press and sintering process with thermal-curable resin. A laboratory manufacturing process was established to develop an ultraviolet-curable resin bond diamond lapping plate, the machining performance of which on the ceramic workpiece was examined through a series of comparative experiments with slurry-based iron plate lapping. The machined surface roughness and weight loss of the workpieces were periodically recorded to evaluate the surface finish quality and the material removal rate. The promising results in terms of a 12% improvement in surface roughness and 25% reduction in material removal rate were obtained from the ultraviolet-curable resin plate-involved lapping process. A summarized hypothesis was drawn to describe the dynamically-balanced state of the hybrid precision abrasive machining process integrated both the two-body and three-body abrasion mode.

14 April 2023 in Journal of Materials Research and Technology
Verified
Journal Article
Open access
HZHao Zhang
Hao Zhang
JHJizhuang Hui
Jizhuang Hui
JLJingxiang Lv
Jingxiang Lv
CLChul-Hee Lee
Chul-Hee Lee
ZYZhiqiang Yan
Zhiqiang Yan
ZXZhiguang Xu
Zhiguang Xu

16 November 2023 in Journal of Intelligent Manufacturing
Verified
Journal Article
Closed access
PDF file
LGLei Guo
Lei Guo
ZDZhengcong Duan
Zhengcong Duan
WGWanjin Guo
Wanjin Guo
Kai DingKai Ding
Kai Ding
CLChul-Hee Lee
Chul-Hee Lee
Felix T. S. ChanFelix T. S. Chan
Felix T. S. Chan

17 May 2019 in IEEE Access
Verified
Journal Article
Open access
LGLei Guo
Lei Guo
XZXinrong Zhang
Xinrong Zhang
CLChul-Hee Lee
Chul-Hee Lee
IMIoan D. Marinescu
Ioan D. Marinescu
YZYihe Zhang
Yihe Zhang
JHJizhuang Hui
Jizhuang Hui
Sapphire is one of the most widely used electronic substrate materials in the industry. The manufacturing process of sapphire and such hard and brittle materials is extremely time and energy consuming because of their superior material properties in physical and chemical behaviors. In this study, the ultraviolet-curable resin is introduced into the fabrication of the diamond abrasive lapping plate as a bonding agent. A practical manufacturing process is established in the laboratory to develop an ultraviolet-curable resin bond fixed abrasive lapping plate for the precision machining of sapphire substrates, the machining performance of which is examined through a series of comparative experiments among the conventional fixed-abrasive lapping, the slurry-based lapping and this originally developed plate involved lapping. The surface topography and surface roughness of the machined sapphire workpieces are measured to evaluate the surface quality, and the weight loss of the workpieces in each machining process is recorded to estimate the respective machining efficiency. The promising results achieved from the ultraviolet-curable resin plate lapping process, in terms of a relatively higher material removal rate and better surface quality, indicate that the occurrence of a corporate action integrating both the advantages of the fixed abrasive grains and loose abrasive grains. A summarized hypothesis is drawn to describe the dynamically balanced state of the hybrid precision abrasive machining process, in which the 2-body abrasion and 3-body abrasion material removal mechanism participate simultaneously and interconvert to each other continuously.

1 February 2022 in Journal of Physics: Conference Series
Verified
Conference Paper
Open access
RZRenfeng Zhao
Renfeng Zhao
LGLei Guo
Lei Guo
WGWeiCheng Gao
WeiCheng Gao
XXXudong Xiao
Xudong Xiao
YLYanwei Liu
Yanwei Liu
Screw conveyors are widely used in the transportation of various media in the industry because of their simple structure and low cost. However, some special powders are prone to accumulation during transportation due to their low density, large angle of repose, and poor fluidity, resulting in low transportation accuracy and unable to meet actual working conditions. In this paper, the discrete element method is used to simulate and analyze the powder transportation. The three-dimensional model of the screw conveyor is established and imported into the EDEM software for simulation simulation. The key parameters of the screw conveyor are screw inner diameter, pitch and speed as design variables. Hand in the experiment, and get the optimal solution of the variable parameters through the experimental results.

2 September 2026 in Journal of Manufacturing Systems
Verified
Journal Article
Closed access
LGLei Guo
Lei Guo
CXChen Xu
Chen Xu
JHJizhuang Hui
Jizhuang Hui
YLYunfei Li
Yunfei Li
HWHongyuan Wang
Hongyuan Wang
SYShuming Yang
Shuming Yang