PIN InGaAs short wavelength infrared (SWIR) focal plane array (FPA) detectors have attracted extensive attention due to their high detectivity, high quantum efficiency, room temperature operation, low dark current, and good radiation resistance. Furthermore, InGaAs FPA detectors have wide applications in many fields, such as aviation safety, biomedicine, camouflage recognition, and infrared night vision. Recently, extensive research has been conducted on the extension of the response spectrum from short wavelength infrared (SWIR) to visible light (VIS) through InP substrate removal and reserving the n-InP contact layer. However, there is little research on the absorption of InGaAs detectors in the ultraviolet (UV) band. In this paper, we present an ultra-broadband UV–VIS–SWIR 640 × 512 15 μm InGaAs FPA detector by removing the n-InP contact layer in the active area and reserving the InP contact layer around the pixels for n contact, creating incident light to be directly absorbed by the In_0.53Ga_0.47As absorption layer. In addition, the optical absorption characteristics of InGaAs infrared detectors with and without an n-InP contact layer are studied theoretically. The test results show that the spectral response is extended to the range of 200–1700 nm. The quantum efficiency is higher than 45% over a broad wavelength range of 300–1650 nm. The operability is up to 99.98%, and the responsivity non-uniformity is 3.28%. The imaging capability of InGaAs FPAs without the n-InP contact layer has also been demonstrated, which proves the feasibility of simultaneous detection for these three bands.

The relationship between the performance of avalanche photodiode (APD) and structural parameters of the absorption, grading, and multiplication layers has been thoroughly simulated and discussed using the equivalent materials approach and Crosslight software. Based on separate absorption, grading, charge, and multiplication (SAGCM) structure, the absorption layer of APD was replaced with InGaAs/GaAsSb superlattice compared to conventional InGaAs/InP SAGCM APD. The results indicated that the breakdown voltage increased with the doping concentration of the absorption layer. When the thickness of the multiplication layer increased from 0.1 μm to 0.6 μm, the linear range of punchthrough voltage increased from 16 V to 48 V, and the breakdown voltage decreased at first and then increased when the multiplication layer reached the critical thickness at 0.35 μm. The grading layer could not only slow down the hole carrier, but also adjust the electric field. The dark current was reduced to about 10 nA and the gain was over 100 when the APD was cooled to 240 K. The response wavelength APD could be extended to 2.8 μm by fine tuning the superlattice parameters. The simulation results indicated that the APD using superlattice materials has potential to achieve a long wavelength response, a high gain, and a low dark current.

The resolution of InGaAs FPA detectors is degraded by the electrical crosstalk, which is especially severe in high–density FPAs. We propose a guard-hole structure to suppress the electrical crosstalk in a planar-type 640 × 512 15 μm InGaAs short wavelength infrared FPA detector. For comparison, the frequently used guard ring is also prepared according to the same processing. The calculation results show that the electrical crosstalk with a guard hole is suppressed from 13.4% to 4.5%, reducing by 66%, while the electrical crosstalk with a guard ring is suppressed to 0.4%. Furthermore, we discuss the effects of the guard ring and the guard hole on the dark current, quantum efficiency, and detectivity. Experimental results show the detector with a guard-hole structure has higher performance compared with the detector with a guard-ring structure, the dark current density is reduced by 60%, the QE is increased by 64.5%, and the detectivity is increased by 1.36 times, respectively. The guard-hole structure provides a novel suppression method for the electrical crosstalk of high-density InGaAs detectors.