Silicon-based Hall application-specific integrated circuit (ASIC) chips have become very successful, making them ideal for flexible electronic and sensor devices. In this study, we designed, simulated, and tested flexible hybrid integration angle sensors that can be made using complementary metal-oxide-semiconductor (CMOS) technology. These sensors are manufactured on a 100 µm-thick flexible polyimide (PI) membrane, which is suitable for large-scale production and has strong potential for industrial use. The Hall sensors have a sensitivity of 0.205 V/mT. Importantly, their sensitivity remains stable even after being bent to a minimum radius of 10 mm and after undergoing 100 bending cycles. The experiment shows that these flexible hybrid integration devices are promising as angle sensors.

Silicon-based Hall ASIC chips have become very successful, making them ideal for flexible electronic and sensor devices. In this study, we designed, simulated, and tested flexible angle sensors that can be made using CMOS technology. These sensors are manufactured on a 100 µm thick flexible PI membrane, which is suitable for large-scale production and has strong potential for industrial use. The Hall sensors have a sensitivity of 0.205V/mT. Importantly, their sensitivity remains stable even after being bent to a minimum radius of 10 mm and after undergoing 100 bending cycles. The experiment shows that these flexible devices are promising as angle sensors.

To address the demand for high-density, curved conformal sensing in wearable devices and flexible electronic skin, this paper presents a novel flexible dual-modal sensing array capable of synchronous detection of temperature and magnetic field distributions. We detail the design principles, circuitry, and layout of the core sensing chip. A flexible hybrid integration scheme ensures device flexibility, with single-point tests confirming its excellent dual-modal sensing performance. Mounted on a robotic hand, the array demonstrates simultaneous monitoring of tactile stimuli and environmental temperature. Furthermore, the 6×6 array successfully achieves spatial distribution imaging of both magnetic fields and temperature. This technology holds broad application prospects in human-machine interaction, health monitoring, and robotic tactile perception.

Compact motor-drive and robotic actuation systems require conformal sensing hardware that can simultaneously acquire local temperature and magnetic-field information for thermal protection, condition monitoring, and feedback-oriented operation. Here, we report a flexible hybrid-integrated temperature-magnetic sensing array based on a 1.2 × 0.6 mm² monolithic silicon die integrating a bandgap-referenced PTAT temperature channel and an amplified Hall magnetic channel. The die is assembled on an ultra-thin flexible printed circuit through conductive bonding, gold-wire interconnection, die thinning, and PDMS encapsulation to support compliant operation on curved electromechanical surfaces. Single-point tests show a temperature sensitivity of 5 mV/°C and a magnetic sensitivity of 96.6 mV/mT, corresponding to 483-fold amplification of the intrinsic Hall response; under bending radii ≥20 mm and temperatures from −40 to 125 °C, magnetic sensitivity drift remains within ±2% with channel interference below 1.2%; and a 6 × 6 array with 6 mm pitch demonstrates magnetic localization and spatial temperature mapping. These results support the device as a compact sensing-hardware prototype with potential for motor-drive monitoring and actuator-state perception; however, benchtop validation does not yet demonstrate closed-loop motor-control performance, and future motor-level tests are required.

To meet the needs of wearable devices and flexible electronic skin for curved, flexible temperature sensors, this paper presents a high-reliability flexible hybrid-integrated temperature sensor. Its core includes a CMOS sensor chip with an integrated bandgap reference circuit and dual-path ESD protection. The sensor achieves a low temperature drift of 20 ppm/℃ and 0.99% linearity from -40℃ to 125℃. After flexible integration and 100 bending cycles at a 10 mm radius, the reference voltage varies less than 0.1%, and temperature output shifts less than ±0.5℃. Temperature tests show an accuracy within ±1℃ across the full range, providing a precise and mechanically robust temperature monitoring solution.