Laser doping of n-type 4H-silicon carbide (SiC) semiconductor substrates with boron (B) using a pulsed Nd:YAG laser (λ = 1064 nm) is reported. An aqueous boric acid solution was used as a boron precursor. A simple theoretical heat transfer model was employed to select the laser processing parameters, i.e., laser power and laser-substrate interaction time, and determine the appropriate temperature to dope 4H-SiC substrates. The selected processing parameters ensured that the temperature at the laser-substrate interaction zone was below the SiC peritectic temperature to prevent any crystalline phase transformations in SiC. Fourier-transform infrared spectrometry was conducted to determine the optical properties of both undoped and boron-doped 4H-SiC substrates within the mid-wave infrared (MWIR) wavelength range (3–5 μm). Boron atoms create an acceptor energy level at 0.29 eV above the valence band in the 4H-SiC bandgap, which corresponds to λ = 4.3 μm. Boron-doped 4H-SiC substrate exhibited reduced reflectance and increased absorptance for the MWIR range. An absorption peak at λ = 4.3 μm was detected for the doped substrate. This confirmed the creation of the acceptor energy level in the 4H-SiC bandgap and, thus, doping of 4H-SiC with boron. A notable decrease in the refractive index, i.e., from 2.87 to 2.52, after laser doping of n-type 4H-SiC with boron was achieved.

Semi-insulating (SI) 4H-polytype of silicon carbide (SiC) is a highly desirable wide bandgap semiconductor material for various applications in challenging environments owing to its exceptional characteristics such as high melting point, remarkable thermal conductivity, strong breakdown field, and excellent resistance to oxidation. This study investigates the critical laser processing parameters to operate a pulsed UV 355 nm laser to dope high-purity (HP) SI 4H-SiC substrates with boron. The doping process parameters are examined and simulated for this UV laser doping system using a liquid precursor of boron. Boron atoms create a dopant energy level of 0.3eV in the doped HP 4H-SiC substrates. Diffusion of boron atoms into 4H-SiC substrates modifies the hole density at 0.3eV energy level, and causing a variation in the dynamic refraction index, and absorption index. Consequently, the optical properties of boron doped samples, namely, transmittance, reflectance, and absorbance, can be modified. The current simulation reported in this study explains the motivation of UV optical doping strategy to dope SiC substrates. A beam homogenizer was used to control the laser spot used to generate doping process. The advantage of the beam homogenizer is demonstrated by producing flat-top beams with uniform intensity over a certain area defined by the focusing lens choice. A simple theoretical model is used to select the laser processing parameters for doping SiC substrates. These modeled parameters are used to determine the efficient laser processing parameters for our doping experiments.

4H-silicon carbide (4H-SiC) is a cornerstone for next-generation optoelectronic and power devices owing to its unparalleled thermal, electrical, and optical properties. However, its chemical inertness and low dopant diffusivity for most dopants have historically impeded effective doping. This study unveils a transformative laser-assisted boron doping technique for n-type 4H-SiC, employing a pulsed Nd:YAG laser (λ = 1064 nm) with a liquid-phase boron precursor. By leveraging a heat-transfer model to optimize laser process parameters, we achieved dopant incorporation while preserving the crystalline integrity of the substrate. A novel optical characterization framework was developed to probe laser-induced alterations in the optical constants—refraction index ($\mathrm{n}$) and attenuation index ($\mathrm{k}$)—across the MIDIR spectrum (λ = 3–5 µm). The optical properties pre- and post-laser doping were measured using Fourier-transform infrared spectrometry, and the corresponding complex refraction indices were extracted by solving a coupled system of nonlinear equations derived from single- and multi-layer absorption models. These models accounted for the angular dependence in the incident beam, enabling a more accurate determination of $\mathrm{n}$ and $\mathrm{k}$ values than conventional normal-incidence methods. Our findings indicate the formation of a boron-acceptor energy level at 0.29 eV above the 4H-SiC valence band, which corresponds to λ = 4.3 µm. This impurity level modulated the optical response of 4H-SiC, revealing a reduction in the refraction index from 2.857 (as-received) to 2.485 (doped) at λ = 4.3 µm. Structural characterization using Raman spectroscopy confirmed the retention of crystalline integrity post-doping, while secondary ion mass spectrometry exhibited a peak boron concentration of 1.29 × 10¹⁹ cm⁻³ and a junction depth of 450 nm. The laser-fabricated p–n junction diode demonstrated a reverse-breakdown voltage of 1668 V. These results validate the efficacy of laser doping in enabling MIDIR tunability through optical modulation and functional device fabrication in 4H-SiC. The absorption models and doping methodology together offer a comprehensive platform for paving the way for transformative advances in optoelectronics and infrared materials engineering.