High-entropy ceramics (HECs) have garnered considerable interest due to their exceptional mechanical properties and high-temperature stability. Nevertheless, their inherent brittleness significantly restricts industrial applications, posing a challenge to improving toughness without compromising hardness. This study investigates the role of SiC whiskers (SiCw) in simultaneously suppressing grain growth and enhancing the toughness of high-entropy (Ti_0.2Zr_0.2Hf_0.2Nb_0.2Ta_0.2)C (HEC) composites, while maintaining high hardness during high-pressure high-temperature (HPHT) sintering. HEC-SiCw composites were fabricated via HPHT (P = 5 GPa, T = 2000 °C), with SiCw contents ranging from 0 to 40 mol%. As the SiCw content increased, the growth of HEC grains was inhibited, and the fracture toughness progressively rose to a peak value (K_IC = 9.4 ± 1.2 MPa·m^1/2), representing an increase of approximately 184% compared to that of pure HEC, while Vickers hardness remained stable at 26 GPa. The enhancement in fracture toughness is attributed to the heterogeneous grain distribution and robust grain boundary strength, which facilitated a synergistic combination of transgranular and intergranular fracture mechanisms. These mechanisms induced crack deflection and whisker pull-out, effectively dissipating fracture energy and impeding crack propagation, thereby enhancing toughness. This study presents a novel approach to simultaneously refine grain size and improve toughness in HECs through HPHT processing, providing valuable insights for the development of next-generation ceramic composites.