For the full cross-sectional profile measurement of high-aspect-ratio micro-grooves, traditional measurement methods have blind measurement areas in the vertical sidewall and its intersection area with the bottom. This paper proposes a deflection-based scanning method that utilizes a large length-to-diameter ratio probe to achieve a full cross-sectional profile measurement of micro-grooves. Blind measurement areas were eliminated by a deflection-based scanning method. The complete groove profile was obtained by stitching the positive and reversal deflection-based measurement results. The optimal deflection angle of the probe was calculated by considering the profile-stitching setting and the principle of minimizing the probe deformation during the measurement process. A four-axis measurement system was established to measure high-aspect-ratio micro-grooves, which incorporated a force feedback mechanism to maintain a constant contact force during the measurement and an integrated error separation module to modify the measurement results. The measurement method and system were experimentally validated to achieve a full cross-sectional profile measurement of micro-grooves with a width of 50 μm and an aspect ratio of no less than 3. The standard deviation of the measurement results was 82 nm, and the expanded uncertainty was 108 nm.

Diamond is a promising next-generation semiconductor material, offering a wider band gap, higher electron mobility, and superior thermal conductivity compared with silicon. However, its exceptional hardness makes it challenging to fabricate. In this study, we demonstrate a novel approach to realize material removal on hydrogen-terminated diamond surfaces by atomic force microscope (AFM) tip-based local anodic oxidation. By adjusting both the applied voltage and hydrogen plasma etching parameters, the material is removed over an area larger than the AFM tip size. Notably, the hardness of the material surrounding the removal zone is significantly reduced, enabling it to be scratched with a silicon tip. These findings open a promising pathway for improving the machinability of diamonds in future device applications.