Qingjia Su

Mr. Qingjia Su


Research Focus & Metrics

Academic Career Length

2Years (2025-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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30 April 2025 in Coatings
Verified
Journal Article
Open access
PDF file
ZLZhaoxian Liu
Zhaoxian Liu
QSQingjia Su
Qingjia Su
PWPu Wang
Pu Wang
WZWenzhen Zhao
Wenzhen Zhao
AFAo Fu
Ao Fu
HHHUAN HE
HUAN HE
In this study, the dissimilar joining of aluminum to high-melting-point alloys, including steel, titanium, and copper, was successfully achieved through hot-dipping. By precisely controlling the dipping temperature at 670 °C and maintaining a dipping time of 5 s, uniform aluminum layers with a thickness of 3–4 mm were successfully formed on the surfaces of high-melting-point alloys. This process enabled effective dissimilar metal joining between Al/steel, Al/Ti, and Al/Cu. Metallurgical bonding at the joining interfaces was achieved through the formation of uniform intermetallic compounds, specifically Fe4Al13, TiAl3, Al2Cu, and Al3Cu4, respectively. The different joints exhibited varying mechanical properties: the Al/Cu joint demonstrated the highest shear strength at 79.1 MPa, while the Fe4Al13-containing joint exhibited the highest hardness, reaching 604.4 HV. Numerical simulations revealed that an obvious decrease in interfacial temperature triggered the solidification and growth of the aluminum layer. Additionally, the specific heat and thermal conductivity of the high-melting-point alloys were found to significantly influence the thickness of the aluminum layer. The hot-dip joining technology is well suited for dissimilar metal bonding involving large contact areas and significant differences in melting points.