Zhen Mao

Dr. Zhen Mao

orcid

Research Focus & Metrics

Academic Career Length

2Years (2025-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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1 April 2025 in Peer-to-Peer Networking and Applications
Verified
Journal Article
Closed access
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YWyazhou Wang
yazhou Wang
BLBing Li
Bing Li
JWJiaxin Wu
Jiaxin Wu
GLGuozhu Liu
Guozhu Liu
YLYuqi Li
Yuqi Li
ZMZhen Mao
Zhen Mao

10 July 2025 in Sensors
Verified
Journal Article
Open access
PDF file
ZMZhen Mao
Zhen Mao
BLBing Li
Bing Li
LPLinning Peng
Linning Peng
JWJinghe Wei
Jinghe Wei
The signal-processing architecture of passive surface acoustic wave (SAW) sensors presents significant implementation challenges due to its radar-like operational principle and the inherent complexity of discrete component-based hardware design. While System-in-Package (SiP) has demonstrated remarkable success in miniaturizing electronic systems for smartphones, automotive electronics, and IoT applications, its potential for revolutionizing SAW sensor interrogator design remains underexplored. This paper presents a novel architecture that synergistically combines time-domain ADC design with SiP-based miniaturization to achieve unprecedented simplification of SAW sensor readout systems. The proposed time-domain ADC incorporates an innovative delay chain calibration methodology that integrates physical unclonable function (PUF) principles during time-to-digital converter (TDC) characterization, enabling the simultaneous generation of unique system IDs. The experimental results demonstrate that the integrated security mechanism provides variable-length bit entropy for device authentication, and has a reliability of 97.56 and uniqueness of 49.43, with 53.28 uniformity, effectively addressing vulnerability concerns in distributed sensor networks. The proposed SiP is especially suitable for space-constrained IoT applications requiring robust physical-layer security. This work advances the state-of-the-art wireless sensor interfaces by demonstrating how time-domain signal processing and advanced packaging technologies can be co-optimized to address performance and security challenges in next-generation sensor systems.