An MXene–graphene field-effect transistor (FET) sensor for both influenza virus and 2019-nCoV sensing was developed and characterized. The developed sensor combines the high chemical sensitivity of MXene and the continuity of large-area high-quality graphene to form an ultra-sensitive virus-sensing transduction material (VSTM). Through polymer linking, we are able to utilize antibody–antigen binding to achieve electrochemical signal transduction when viruses are deposited onto the VSTM surface. The MXene–graphene VSTM was integrated into a microfluidic channel that can directly receive viruses in solution. The developed sensor was tested with various concentrations of antigens from two viruses: inactivated influenza A (H1N1) HA virus ranging from 125 to 250,000 copies/mL and a recombinant 2019-nCoV spike protein ranging from 1 fg/mL to 10 pg/mL. The average response time was about ∼50 ms, which is significantly faster than the existing real-time reverse transcription-polymerase chain reaction method (>3 h). The low limit of detection (125 copies/mL for the influenza virus and 1 fg/mL for the recombinant 2019-nCoV spike protein) has demonstrated the sensitivity of the MXene–graphene VSTM on the FET platform to virus sensing. Especially, the high signal-to-viral load ratio (∼10% change in source-drain current and gate voltage) also demonstrates the ultra-sensitivity of the developed MXene–graphene FET sensor. In addition, the specificity of the sensor was also demonstrated by depositing the inactivated influenza A (H1N1) HA virus and the recombinant 2019-nCoV spike protein onto microfluidic channels with opposite antibodies, producing signal differences that are about 10 times lower. Thus, we have successfully fabricated a relatively low-cost, ultrasensitive, fast-responding, and specific inactivated influenza A (H1N1) and 2019-nCoV sensor with the MXene–graphene VSTM.

Two-dimensional transition metal carbides (MXenes) have attracted a great interest of the research community as a relatively recently discovered large class of materials with unique electronic and optical properties. Understanding of adhesion between MXenes and various substrates is critically important for MXene device fabrication and performance. We report results of direct atomic force microscopy (AFM) measurements of adhesion of two MXenes (Ti₃C₂T_x and Ti₂CT_x) with a SiO₂ coated Si spherical tip. The Maugis-Dugdale theory was applied to convert the AFM measured adhesion force to adhesion energy, while taking into account surface roughness. The obtained adhesion energies were compared with those for mono-, bi-, and tri-layer graphene, as well as SiO₂ substrates. The average adhesion energies for the MXenes are 0.90 ± 0.03 J m⁻² and 0.40 ± 0.02 J m⁻² for thicker Ti₃C₂T_x and thinner Ti₂CT_x, respectively, which is of the same order of magnitude as that between graphene and silica tip.

In this study, a lightweight prestressed steel jacket (PSJ) was proposed and developed for rapid and cost-effective repair of a severely damaged circular reinforced concrete column. The PSJ is composed of several prestressed strands, and a thin steel sheet is restrained by these strands, which can be manually wrapped around and jointed to form a jacket on the column as part of a 12-h repair job by two workers. The prestressed strands restrain the thin sheet from buckling, while the steel sheet in turn prevents the strands from cutting into cracked concrete and thus preserves the prestressing forces. The PSJ was validated with cyclic (reversed) testing of two large-scale columns with lap-splice deficiency under incrementally increased displacements every three cycles. The ultimate strength and displacement ductility of the damaged column were restored to 115% and 140%, respectively, of those of the as-built column. The initial stiffness of the damaged column, however, was restored to only 84% of t...

In this paper, we demonstrated the plasticity mechanism for copper (Cu) extrusion in through-silicon via structures under thermal cycling. The local plasticity was directly observed by synchrotron x-ray micro-diffraction near the top of the via with the amount increasing with the peak temperature. The Cu extrusion was confirmed by Atomic Force Microscopy (AFM) measurements and found to be consistent with the observed Cu plasticity behavior. A simple analytical model elucidated the role of plasticity during thermal cycling, and finite element analyses were carried out to confirm the plasticity mechanism as well as the effect of the via/Si interface. The model predictions were able to account for the via extrusions observed in two types of experiments, with one representing a nearly free sliding interface and the other a strongly bonded interface. Interestingly, the AFM extrusion profiles seemed to contour with the local grain structures near the top of the via, suggesting that the grain structure not only affects the yield strength of the Cu and thus its plasticity but could also be important in controlling the pop-up behavior and the statistics for a large ensemble of vias.