In this paper we provide explanations to the complex growth phenomena of GaN heteroepitaxy on nonpolar orientations using the concept of kinetic Wulff plots (or v-plots). Quantitative mapping of kinetic Wulff plots in polar, semipolar, and nonpolar angles are achieved using a differential measurement technique from selective area growth. An accurate knowledge of the topography of kinetic Wulff plots serves as an important stepping stone toward model-based control of nonpolar GaN growth. Examples are illustrated to correlate growth dynamics based on the kinetic Wulff plots with commonly observed features, including anisotropic nucleation islands, highly striated surfaces, and pentagonal or triangular pits.

A distributed Bragg reflector (DBR) is a key building block in the formation of semiconductor microcavities and vertical cavity surface emitting lasers (VCSELs). The success in epitaxial GaAs DBR mirrors paved the way for the ubiquitous deployment of III-V VCSELs in communication and mobile applications. However, a similar development of GaN-based blue VCSELs has been hindered by challenges in preparing DBRs that are mass producible. In this article, we provide a review of the history and current status of forming DBRs for GaN VCSELs. In general, the preparation of DBRs requires an optimization of epitaxy/fabrication processes, together with trading off parameters in optical, electrical, and thermal properties. The effort of epitaxial DBRs commenced in the 1990s and has evolved from using AlGaN, AlN, to using lattice-matched AlInN with GaN for DBRs. In parallel, dielectric DBRs have been studied since 2000 and have gone through a few design variations including epitaxial lateral overgrowth (ELO) and vertical external cavity surface emitting lasers (VECSEL). A recent trend is the use of selective etching to incorporate airgap or nanoporous GaN as low-index media in an epitaxial GaN DBR structure. The nanoporous GaN DBR represents an offshoot from the traditional epitaxial approach and may provide the needed flexibility in forming manufacturable GaN VCSELs. The trade-offs and limitations of each approach are also presented.

The authors report the growth of AlGaN epilayers and deep ultraviolet (UV) light emitting diodes (LEDs) on bulk AlN substrates. Heteroepitaxial nucleation and strain relaxation are studied through controlled growth interruptions. Due to a low density of preexisting dislocations in bulk AlN, the compressive strain during AlGaN heteroepitaxy cannot be relieved effectively. The built-up of strain energy eventually induces either an elastic surface roughening or plastic deformation via generation and inclination of dislocations, depending on the stressor interlayers and growth parameters used. AlGaN LEDs on bulk AlN exhibit noticeable improvements in performance over those on sapphire, pointing to a promising substrate platform for III-nitride UV optoelectronics.

In this paper, we report a detailed study on the evolution of surface morphology and microstructure of nonpolar a-plane GaN (a-GaN) through controlled growth interruptions. Microscopy imaging shows that the two-step a-GaN growth went through a roughening-recovery process. The first-step growth (under high V/III and high pressure) produced a rough surface with tall mesas separated by voids. The second-step growth (under low V/III and low pressure) promoted the lateral growth and filled up the voids. Striations that formed during the island coalescence persisted throughout the second-step growth, but could be relieved by an additional third-step growth. The morphological evolution was explained according to the kinetic Wulff plots. The microstructure of the a-GaN films was investigated by transmission electron microscopy (TEM) and x-ray rocking curve analysis. Most of the extended defects observed in the plan-view TEM images were I1 type basal-plane stacking faults (BSFs) and their associated partial dislocations (PDs). It is found that the bending of PDs (at the inclined/vertical growth fronts) within the basal plane toward the m-axes was responsible for the substantial reduction in threading PDs and the increase in BSF dimension. Based on a careful correlation between the morphological evolution and the microstructure development, we proposed a model explaining the possible mechanisms for the great reduction in defect density during the two-step growth process.