Qipeng Li

Dr. Qipeng Li


Research Focus & Metrics

Academic Career Length

2Years (2025-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

View All Publications
13 March 2025 in Buildings
Verified
Journal Article
Open access
PDF file
ZYZhengchao Yang
Zhengchao Yang
QYQiufei Yao
Qiufei Yao
Yu WangYu Wang
Yu Wang
俊古俊龙 古
俊龙 古
ZYZhichen Yu
Zhichen Yu
XYXuejing Yang
Xuejing Yang
Microchannel liquid-cooled plates are widely used in high-performance electronic devices, but their heat transfer performance and pressure drop characteristics face complex challenges in the design process. In this paper, a counter-flow rectangular microchannel liquid-cooled plate is designed, and the effects of velocity, aspect ratio, and inlet/outlet forms on its heat transfer and pressure drop performance are investigated through orthogonal tests and numerical simulations. The results indicate that the velocity plays a crucial role in determining the plate’s performance. While increasing the velocity substantially enhances heat transfer efficiency, it also causes a steep rise in pressure drop. The aspect ratio has a lesser effect on the performance than the velocity, and smaller aspect ratios help to achieve a balance between thermal and flow properties. The comprehensive optimization of the inlet and outlet forms and velocity has a significant effect on the temperature uniformity and pressure drop, and the design of the cooling fluid inlet and outlet form of CM (side inlet and middle outlet) can effectively improve the temperature distribution and reduce the pressure drop at high velocity. The design parameters with the best overall performance are the aspect ratio of 2, the velocity of 0.5 m/s, and the CM inlet/outlet form (K2V0.5CM). Comparison with other design parameter sets verified that this parameter set showed significant advantages in cooling effect, temperature uniformity, flow and heat transfer performance. Finally, the correlation equation on Nu is established, and the simulated Nu as well as the calculated Nu are compared. In this thesis, a counter-flow rectangular microchannel cold plate is designed to optimize the flow rate, channel structure and other parameters through orthogonal tests to reduce the temperature gradient and balance the heat transfer and flow resistance to meet the demand for efficient heat dissipation of 350 W CPU. This study provides an important reference for the structural optimization of microchannel liquid-cooled panels and the engineering application of high-efficiency heat dissipation systems.

22 June 2025 in Energies
Verified
Journal Article
Open access
PDF file
QLQipeng Li
Qipeng Li
Yu WangYu Wang
Yu Wang
WTWenhui Tang
Wenhui Tang
Risto KosonenRisto Kosonen
Risto Kosonen
LXLujiang Xu
Lujiang Xu
XSXiaoyi Sun
Xiaoyi Sun
The parallel multi-branch pipeline system is usually used for fluid transportation and distribution in the cooling of high-power electronic equipment, especially in radar equipment. Using CFD software, a simulation study was conducted to analyze the fluid flow distribution and heat transfer characteristics within a 6 × 5 parallel multi-branch pipe. This study examined how the dimensions of the fluid channels in the liquid cooling system affected the uniformity of flow distribution and the cooling effectiveness of the system for electronic equipment. The deviation from the design flow rate was used as an evaluation criterion to assess flow distribution uniformity across the branches and components of the multi-branch liquid cooling system. After ensuring uniform flow distribution, the overall heat transfer characteristics of the liquid cooling system were analyzed. The main findings are as follows: by adjusting the flow channel dimensions within the system, the overall flow distribution uniformity increased by 10%, with the deviation from the design flow rate in each T/R component remaining within 20%. The 6 × 5 parallel multi-branch cold plate efficiently cools T/R components with heat flux densities of up to 500 W/cm2, maintaining the maximum component temperature below 358 K.