We design and experimentally demonstrate an ultrashort integrated polarization splitter on silicon-on-insulator (SOI) platform. Our polarization splitter uses a hybrid plasmonic waveguide as the middle waveguide in a three-core arrangement to achieve large birefringence, allowing only transverse-magnetic (TM) polarized light to directionally couple to the cross port of the directional coupler. Finite-difference time-domain (FDTD) and eigenmode expansive (EME) calculations show that the splitter can achieve an extinction ratio of greater than 15 dB with less than 0.5 dB insertion losses. The polarization splitter was fabricated on SOI platform using standard complementary metal-oxide-semiconductor (CMOS) technology and measured at telecommunications wavelengths. Extinction ratios of 12.3 dB and 13.9 dB for the transverse-electric (TE) and TM polarizations were obtained, together with insertion losses of 2.8 dB and 6.0 dB.

Horizontal metal/insulator/Si/insulator/metal nanoplasmonic slot waveguide (PWG), which is inserted in a conventional Si wire waveguide, is fabricated using the standard Si-CMOS technology. A thin insulator between the metal and the Si core plays a key role: it not only increases the propagation distance as the theoretical prediction, but also prevents metal diffusion and/or metal-Si reaction. Cu-PWGs with the Si core width of ~134–21 nm and ~12-nm-thick SiO₂ on each side exhibit a relatively low propagation loss of ~0.37–0.63 dB/µm around the telecommunication wavelength of 1550 nm, which is ~2.6 times smaller than the Al-counterparts. A simple tapered coupler can provide an effective coupling between the PWG and the conventional Si wire waveguide. The coupling efficiency as high as ~0.1–0.4 dB per facet is measured. The PWG allows a sharp bending. The pure bending loss of a Cu-PWG direct 90° bend is measured to be ~0.6–1.0 dB. These results indicate the potential for seamless integration of various functional nanoplasmonic devices in existing Si electronic photonic integrated circuits (Si-EPICs).

Hydrogenated amorphous silicon (a-Si:H) wire waveguides were fabricated by plasma-enhanced chemical vapor deposition and anisotropic dry etching. With the optimized fabrication process, the propagation losses of as low as 3.2 ± 0.2 dB/cm for the TE mode and 2.3 ± 0.1 dB/cm for the TM mode were measured for the 200 nm (height) × 500 nm (width) wire waveguides at 1550 nm using the standard cutback method. The loss becomes larger at shorter wavelength (~4.4 dB/cm for TE and ~5.0 dB/cm for TM at 1520 nm) and smaller at longer wavelength (~1.9 dB/cm for TE and ~1.4 dB/cm for TM at 1620 nm). With the waveguide width shrinking from 500 nm to 300 nm, the TM mode loss keeps almost unchanged whereas the TE mode loss increases, indicating that the predominant loss contributor is the waveguide sidewall roughness, similar to the crystalline silicon waveguides. Although the a-Si:H and the upper cladding SiO₂ were both deposited at 400°C, the propagation loss of the fabricated a-Si:H wire waveguides starts to increase upon furnace annealing under atmosphere at a temperature larger than 300°C: ~13–15 dB/cm after 400°C/30 min annealing and >70 dB/cm after 500°C/30 min annealing, which can be attributed to hydrogen out-diffusion. Even higher temperature (i.e., >600°C) annealing leads to the propagation loss approaching to the polycrystalline silicon counterparts (~40-50 dB/cm) due to onset of a-Si:H solid-phase crystallization.

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In this paper, a Mach-Zehnder silicon nanoplasmonic electro-optic modulator is proposed and theoretically analyzed. It is composed of horizontal metal-SiO₂-Si-metal plasmonic slot waveguides for phase shifting and ultracompact V-shape splitter/combiner to link the plasmonic slot waveguides and the conventional Si dielectric waveguides. The proposed modulator can be directly integrated into existing Si electronic photonic integrated circuits (EPICs) and be fabricated using standard Si complementary metal-oxide-semiconductor (CMOS) technology. The modulator’s parameters are optimized through systematic 2-dimensional numerical simulations. For a modulator with 3-µm-long Ag-SiO₂(2 nm)-Si(50 nm)-Ag phase shifter and 0.35-µm-long splitter/combiner operating at 1.55-µm wavelength, simulation shows an insertion loss of ~–8 dB, an extinction ratio of ~7.3 dB — with a switching voltage of ~5.6 V, and a bandwidth of ~500 GHz. A possible approach to reduce the switching voltage is addressed.

An AlN electro-optic phase shifter with a parallel plate capacitor structure is fabricated on Si using the back-end complementary metal-oxide-semiconductor technology, which is feasible for multilayer photonics integration. The modulation efficiency (V_π⋅L_π product) measured from the fabricated waveguide-ring resonators and Mach-Zehnder Interferometer (MZI) modulators near the 1550-nm wavelength is ∼240 V⋅cm for the transverse electric (TE) mode and ∼320 V⋅cm for the transverse magnetic (TM) mode, from which the Pockels coefficient of the deposited AlN is deduced to be ∼1.0 pm/V for both TE and TM modes. The methods for further modulation efficiency improvement are addressed.