The production of power electronic modules re-quires cost-effective manufacturing of customer-specific small batches to meet today's requirements. Consequently, traditional methods of production are being replaced by highly flexible and fully automated manufacturing processes. This paper introduces a novel approach: a robot-assisted laser beam welding method designed to join copper clips with power modules' Direct Bonded Copper substrates and power terminals. The proposed setup involves using two six-axis articulated robots to assemble the components. Additionally, stationary scanner optics are utilized to guide a laser beam with a wavelength of 515 nm in order to establish the connections. To investigate the feasibility of the proposed approach initial experiments which focus on examining the influence of the pick and place process on the laser beam welding were conducted. The results demonstrate the feasibility of the manufacturing concept while showing a correlation between the geometry of the copper clamp, the clamping force and the resulting gap between the welded copper clamp and the Direct Bonded Copper. The findings obtained from these experiments contribute valuable insights toward the development of a flexible and reliable production method for power electronic modules.

As power electronic modules are increasingly required to provide improved heat dissipation, aluminum nitride (AlN) stands out against other ceramic materials. At the same time, more cost-efficient production of customized products demands shorter development cycles and innovative manufacturing processes. Conventional process chains in power electronics are usually long and inflexible; thus, innovative ways to reduce process steps and faster prototyping are needed. Therefore, this study investigates the usage of additive manufacturing technology—laser-based powder bed fusion of metal powder (PBF-LB/M)—namely copper (Cu), on AlN substrates for power electronic applications. It is found that specific electrical conductivity values can be achieved up to 31 MS/m, and adhesion measured by shear testing reaches 15 MPa. In reliability testing, the newly produced samples exhibit a 25% decrease in adhesion after 250 cycles, which is comparatively moderate. This study shows the feasibility of PBF-LB/M of Cu powder on AlN, emphasizing its strengths and highlighting remaining weaknesses.

Metal anodes offer substantially higher specific and volumetric capacities than conventional anode materials such as graphite in lithium-ion batteries or hard carbon in sodium-ion batteries. However, the integration of metal anodes into solid-state batteries poses significant challenges, particularly with respect to processing, interfacial stability, and cell assembly. Anode-free solid-state batteries (AFSSBs) address these challenges by eliminating the pre-installed metal anode, instead forming the metal in situ during the initial charging (formation) step. In anode-free solid-state batteries, the quality of the interfacial contact is particularly critical, as insufficient contact can lead to locally increased current densities. Consequently, the initial metal plating during the formation step plays a decisive role in determining the homogeneity and stability of the anode interface. Furthermore, conventional battery-grade copper foils (~10 µm) are considerably thicker than required for the targeted C-rates and are difficult to use as stand-alone anode-free current collectors, thereby hindering the industrial production of anode-free solid-state batteries. In this publication, we demonstrate the application of atmospheric plasma spraying (APS) to fabricate thin copper current collectors directly on the ceramic solid electrolytes LAGP (lithium aluminium germanium phosphate) and BASE (beta-alumina solid electrolyte) with superior interface contact. No mechanical damage or diffusion of copper into the solid electrolyte nor formation of secondary phases at the interfaces were observed in SEM or EDS despite the elevated process temperature. LAGP with a thickness as low as 300 µm was successfully coated and subsequently used for plating/stripping experiments. Finally, dense sodium metal was plated at the copper-substrate interface of a 1.4 mm thick BASE sample.