Powder bed fusion of copper has been extensively investigated using both laser-based (PBF-LB/M) and electron beam-based (PBF-EB/M) additive manufacturing technologies. Each technique offers unique benefits as well as specific limitations. Near-infrared (NIR) laser-based LPBF is widely accessible; however, the high reflectivity of copper limits energy absorption, thereby resulting in a narrow processing window. Although optimized parameters can yield relative densities above 97%, issues such as keyhole porosity, incomplete melting, and anisotropy remain concerns. Green lasers, with higher absorptivity in copper, offer broader process windows and enable more consistent fabrication of high-density parts with superior electrical conductivity, often reaching or exceeding 99% relative density and 100% International Annealed Copper Standard (IACS). Mechanical properties, including tensile and yield strength, are also improved, though challenges remain in surface finish and geometrical resolution. In contrast, Electron Beam Powder Bed Fusion (EB-PBF) uses high-energy electron beams in a vacuum, eliminating oxidation and leveraging copper’s high conductivity to achieve high energy absorption at lower volumetric energy densities (~80 J/mm³). This results in consistently high relative densities (>99.5%) and excellent electrical and thermal conductivity, with additional benefits including faster scanning speeds and in situ monitoring capabilities. However, EB-PBF processes in general face their own limitations, such as surface roughness and powder smoking. This paper provides a comprehensive review of the current state of laser-based (PBF-LB/M) and electron beam-based (PBF-EB/M) powder bed fusion processes for the additive manufacturing of copper, summarizing key trends, material properties, and process innovations. Both approaches continue to evolve, with ongoing research aimed at refining these technologies to enable the reliable and efficient additive manufacturing of high-performance copper components.

Lack of fusion (LOF) is a dominant defect in Laser Powder-Bed Fusion (PBF-LB/M) caused by insufficient overlapping between adjacent melt pools. This study introduces a rapid, first-principles model based on Rosenthal’s analytical solution for a moving point heat source to predict melt pool geometry. Using geometric criteria, the model evaluates whether the melt pool width exceeds the hatching distance and whether the melt pool depth exceeds the layer thickness. Based on these conditions, LOF-based process windows are constructed by plotting laser power against scanning speed and classifying each parameter combination as either LOF or no LOF. The process developed here for constructing LOF process windows can be applied to metallic PBF-LB/M systems. As PBF-LB/M of copper is commonly associated with LOF defects, the approach is examined for pure copper by evaluating a range of laser powers and scanning speeds for both near-infrared (NIR) (1064 nm) and green (515 nm) lasers using copper-specific absorptivity values. The resulting process windows are validated against literature-reported relative density data for pure copper, using high relative density values as indicators of full fusion and lower relative density values reported with LOF characteristics as indicators of lack of fusion. For a 30 µm layer thickness, the predicted LOF boundary agreed with 43 of 46 literature-reported copper PBF-LB/M data points when the data were classified using relative density and reported defect morphology. Sensitivity analysis showed that the agreement changed modestly when the relative-density threshold was reduced from 99% to 98.5% and 98% and that near-boundary classifications were sensitive to the selected absorptivity within the reported NIR range. The agreement supports the use of the framework as a preliminary screening tool for identifying LOF-prone parameter regions. By providing a fast, physics-based screening tool for LOF-limited process windows, this framework offers a computationally efficient alternative to high-fidelity numerical simulations commonly used in PBF-LB/M process development.