In order to enhance the heat dissipation of a chip, this work investigates the enhancement of the thermal homogenization effect of a ceramic substrate with a high-thermal-conductivity graphene material to improve the interfacial heat transfer performance. AgCuTi-activated brazing material is used to connect the graphene film/AlN. The mechanism of the influence of brazing temperatures on the microstructure and thermal conductivity of joints is discussed. The thermal conductivity of the graphene/AlN double layer composite brazed at 890 °C for 10 min holding time was the highest at 482.3 W m⁻¹ K⁻¹. This study provides a new solution for the application of AlN ceramics in high-heat-flow scenarios.