The reliability of integrated circuit (IC) is their ability to perform specified functions under prescribed conditions and within a specified period. With the rapid development of IC technology, reliability testing has become a key link in ensuring product performance and lifespan. This article reviews the basic concepts, testing processes, key technologies, and challenges and future development of IC reliability testing. First, the significance, classification, and basic processes of reliability testing are introduced. Then, key links such as design verification testing, wafer testing, chip testing, and packaging testing are discussed in detail. Next, key technologies such as Early Failure Rate Testing (EFR), High/Low Temperature Operating Life Tests (HTOL/LTOL), Accelerated Temperature-Humidity and Bias Testing (THB), Highly Accelerated Stress Test (HAST), and Temperature Cycle Testing (TCT) are analyzed. Additionally, challenges such as balancing testing costs and efficiency, innovating testing technologies, and analyzing and processing testing data are explored, along with corresponding strategies. Finally, the development of new testing technologies, the trend towards intelligent testing, and the internationalization of testing standards are discussed as future directions. This article aims to provide a reference for researchers and engineers in the field of IC design and testing to promote the progress and innovation of reliability testing technology.