With the growing demand for reliable, low-impact deployment systems in small satellite missions, this work introduces an antenna deployment mechanism using fiber-reinforced shape memory polymer composites (SMPC). The mechanism utilized thermally activated SMPCs for stowage and release, configured with different glass transition temperatures (T_g), tuned through the addition of poly(ethylene glycol) (PEG-600), for sequential actuation. The deployment mechanism consisted of three SMPC components with varying PEG concentrations: SMPC-P (0 wt%), SMPC-5 (5 wt%), and SMPC-10 (10 wt%). For component design, three bending angle configurations (BAC) of 20°, 30°, and 40° were tested. The samples exhibited the highest fixity ratio (93.58%, 95.76%, and 96.52% for SMPC-P, SMPC-5, and SMPC-10, respectively) when conformed to the 20° BAC. All samples achieved full recovery within 2 min, with PEG-incorporated composites exhibiting more uniform behavior across cycles, while recovery rates varied by material and BAC. Deployment testing confirmed the antenna was released successfully across all BACs. The 20° BAC exhibited the fastest response, completing deployment 24 s and 30 s ahead of the 30° and 40° BACs, respectively. The proposed mechanism exhibits promising potential for integration in future CubeSat missions. However, further testing under simulated space conditions is necessary to comprehensively assess and validate its performance.

Shape memory polymer composites (SMPCs) are an intelligent class of materials capable of self-actuation, offering promising applications in diverse stimuli-responsive material systems. This study developed epoxy-based SMPCs reinforced with carbon–aramid fibers at a 15:85 ratio, with their glass transition temperature (T_g) tailored by incorporating 5 wt.% (SMPC-5) and 10 wt.% (SMPC-10) polyethylene glycol (PEG-600). Dynamic mechanical analysis (DMA) confirmed that PEG addition effectively reduced the T_g from 89.79 °C in the neat composite (SMPC-P) to 70.28 °C in SMPC-5 and 59.34 °C in SMPC-10. Incorporating 5 wt.% PEG enhanced storage and loss moduli, whereas excessive plasticization at 10 wt.% reduced stiffness. Infrared spectroscopy analysis revealed shifts and increased intensities in hydroxyl (OH), aliphatic C-H, and carbonyl (C=O) groups, indicating enhanced intermolecular interactions and bond formation. Tensile testing showed that the carbon–aramid filler significantly improved tensile strength and stiffness, with SMPC-10 achieving the highest tensile strength (233.59 MPa) and SMPC-5 the highest Young’s modulus (14.081 GPa). These results highlight the complementary role of carbon–aramid reinforcement and PEG plasticization in tuning thermomechanical behavior, providing baseline insights for designing SMPCs with tailored actuation and reliable structural performance.