The integrity and reliability of surface protective coatings deposited on metal surface could be in-situ monitored via the attractive luminescence sensing technique. In this paper, we report the influence of substrate temperature on the properties of erbium (Er) doped aluminum nitride (AlN) film, which could be applied as a luminescent layer for monitoring the health of multilayered Al/AlN coating. The AlN:Er films were deposited via reactive radio-frequency magnetron sputtering, and the silicon substrate temperature was varied from non-intentional heating up to 400 °C. The composition, morphology, crystalline structure, and dielectric function of the AlN:Er films deposited under these different substrate temperature conditions were studied. These properties of the AlN:Er films show strong correlation with the substrate temperature maintained during film fabrication. The obtained AlN:Er films, without further annealing, exhibited photoluminescence peaks of the Er³⁺ ions in the visible wavelength range and the strongest photoluminescence intensity was observed for the AlN:Er film deposited with the temperature of substrate kept at 300 °C. The results demonstrated in this work offer guidance to optimize the substrate temperature for the deposition of AlN:Er film for future application of this sensing technique to thin metal components.

Depleted uranium (DU) is oxidized readily due to its chemical activities, which limits its applications in nuclear industry. TiN film has been applied widely due to its good mechanical properties and its excellent corrosion resistance. In this work, TiN protection films were deposited on DU by direct current magnetron sputtering (DCMS) and high power pulsed magnetron sputtering (HPPMS), respectively. The surface morphology and microstructures were investigated by atomic force microscope (AFM), scanning electron microscopy (SEM), and grazing incidence X-ray diffraction (GIXRD). The hardness and Young’s modulus were determined by nano-Indenter. The wear behavior and adhesion was analyzed by pin-on-disc tests and scratch adhesion tests and the corrosion resistance was evaluated by electrochemical measurements. The results show that the TiN films that were deposited by HPPMS outperformed TiN film deposited by DCMS, with improvements on surface roughness, mechanical properties, wear behavior, adhesion strength, and corrosion resistance, thanks to its much denser columnar grain growth structure and preferred orientation of (111) plane with the lowest strain energy. Besides, the process of Ti interlayer deposition by HPPMS can enhance the film properties to an extent as compared to DCMS, which is attributed to the enhanced ion bombardment during the HPPMS.