Wei Yang

Dr. Wei Yang

orcid

Research Focus & Metrics

Academic Career Length

3Years (2024-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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24 September 2024 in Journal of Materials Research and Technology
Verified
Journal Article
Open access
WYWei Yang
Wei Yang
YWYiwei Wang
Yiwei Wang
XHXiaozhong Huang
Xiaozhong Huang
SLShuhong Liu
Shuhong Liu
PWpeisheng wang
peisheng wang
YDYong Du
Yong Du

7 June 2025 in Materials Science and Engineering: A
Verified
Journal Article
Closed access
WYWei Yang
Wei Yang
XHXiaozhong Huang
Xiaozhong Huang
PWpeisheng wang
peisheng wang
SLShuhong Liu
Shuhong Liu
YDYong Du
Yong Du

23 September 2025 in Materials Science and Engineering: A
Verified
Journal Article
Closed access
WYWei Yang
Wei Yang
XHXiaozhong Huang
Xiaozhong Huang
JYJianling Yue
Jianling Yue
PWpeisheng wang
peisheng wang
SLShuhong Liu
Shuhong Liu
YDYong Du
Yong Du

27 October 2025 in Materials
Verified
Journal Article
Open access
PDF file
WYWei Yang
Wei Yang
QLQingzhu Liu
Qingzhu Liu
WHWeiyin Huang
Weiyin Huang
XHXiaozhong Huang
Xiaozhong Huang
PWPeisheng Wang
Peisheng Wang
YDYong Du
Yong Du
Eight diffusion couples were fabricated to systematically investigate the composition-dependent interdiffusion behavior in hcp Dy-Y, Dy-Nd, Sm-Nd, and Sm-Tb binary alloys. The interdiffusion coefficients were determined at two representative temperatures using the Sauer–Freise method based on concentration–distance profiles measured by electron probe microanalysis (EPMA). These experimentally obtained diffusivities, together with available thermodynamic data, were subsequently employed to assess the atomic mobilities of each system by means of the CALTPP (CALculation of Thermo Physical Properties) program within the CALPHAD (CALculation of PHAse Diagrams) framework. The optimized mobility parameters provide a reliable description of the diffusion behavior in all investigated alloys. This reliability is confirmed by the close agreement between the calculated and experimentally measured interdiffusion coefficients, as well as by the strong consistency between the model-predicted and experimental concentration profiles. The present work thus establishes the first set of critically evaluated atomic mobility parameters for these hcp rare-earth binary systems. These results fill an important gap in the kinetic database of rare-earth alloys and lay a robust foundation for future multi-component CALPHAD-based simulations, thereby supporting the design and optimization of advanced rare-earth permanent magnets with improved coercivity and thermal stability.

6 August 2025 in Materials
Verified
Journal Article
Open access
PDF file
Kun LiuKun Liu
Kun Liu
ZWZhenxiang Wu
Zhenxiang Wu
DLDong Luo
Dong Luo
XHXiaozhong Huang
Xiaozhong Huang
WYWei Yang
Wei Yang
PWPeisheng Wang
Peisheng Wang
The phase equilibria of the Si-C-Cu ternary system at 700 °C and 810 °C were experimentally investigated for the first time. Fifteen key alloys were prepared via powder metallurgy and analyzed using X-ray diffraction (XRD), scanning electron microscopy (SEM), and electron probe microanalysis (EPMA). Isothermal sections were constructed based on the identified equilibrium phases. At 700 °C, eight single-phase regions and six three-phase regions—(C)+(Cu)+hcp, (C)+hcp+γ-Cu33Si7, (C)+γ-Cu33Si7+SiC, γ-Cu33Si7+SiC+ε-Cu15Si4, SiC+ε-Cu15Si4+η-Cu3Si(ht), and SiC+(Si)+η-Cu3Si(ht)—were determined. At 810 °C, nine single-phase regions and seven three-phase regions were identified. The solubility of C and Si/Cu in the various phases was quantified and found to be significantly higher at 810 °C compared to 700 °C. Key differences include the presence of the bcc (β) and liquid phases at 810 °C. The results demonstrate that higher temperatures promote increased mutual solubility and reaction tendencies among Cu, C, and Si. Motivated by these findings, the influence of vacuum hot pressing parameters on SiC-fiber-reinforced Cu composites (SiCf/Cu) was investigated. The optimal processing condition (1050 °C, 60 MPa, 90 min) yielded a high bending strength of 998.61 MPa, attributed to enhanced diffusion and interfacial bonding facilitated by the high-temperature phase equilibria. This work provides essential fundamental data for understanding interactions and guiding processing in SiC-reinforced Cu composites.