With planar complementary metal-oxide-semiconductor (CMOS) scaling nearing its physical limits, the transistor roadmap is transitioning toward monolithic three-dimensional (M3D) integration through complementary field-effect transistors (CFETs). While silicon (Si)-CFETs demonstrate the viability of monolithic stacking, their scalability is constrained by high thermal budgets, dopant diffusion, and alignment complexity. Two-dimensional (2D) materials offer atomically thin semiconducting channels with strong electrostatics and low-temperature process compatibility, making them promising candidates for back-end-of-line (BEOL) compatible CFETs integration and potential future front-end-of-line (FEOL) replacement. This Perspective outlines the challenges and prospects for 2D CFETs, addressing 2D material synthesis, n-/p-type 2D channel engineering, low-resistance metal contact, reliable gate dielectric integration, FEOL/BEOL compatibility and interconnect co-design for M3D architectures. Furthermore, we compare the heat dissipation and energy consumption between Si-CFET and 2D-CFET with different stacking configurations, predicting the superior thermal and power-efficiency benefits of 2D channels. These insights position 2D CFETs as an attractive platform, offering a scalable and thermally efficient pathway toward the Ångström-era logic architecture.

Massive, eco-friendly, and facile fabrications of AAOs are realized, which can be utilized as template for nanomaterials and sensing platform.

Two-dimensional (2D) materials offer exceptional electrical, optical, and mechanical properties but face challenges in terms of scalability, stability, and integration. Hybridizing 2D materials with polymers provides an effective route to overcome these limitations by enabling tunable interfaces, mechanical compliance, chemical functionality, and three-dimensional device processability. This review summarizes the fundamental structural configurations of 2D–polymer hybrids, including embedded composites, stacked heterostructures, covalently functionalized interfaces, polymer-encapsulated layers, and fiber–network architecture, and describes how their interfacial interactions dictate charge transport, environmental robustness, and mechanical behavior. We also highlight major fabrication strategies, such as solution dispersion, in situ polymerization, and vapor-phase deposition. Finally, we discuss emerging applications in sensors, optoelectronics, neuromorphic systems, and energy devices, demonstrating how synergistic coupling between 2D materials and functional polymers enables enhanced sensitivity, programmable electronic states, broadband photodetection, and improved electrochemical performance. These insights provide design guidelines for future multifunctional and scalable 2D–polymer hybrid platforms.