An investigation of the relationship between the microstructure parameters and thermomechanical properties of epoxy resin can provide a scientific basis for the optimization of epoxy systems. In this paper, the thermomechanical properties of diglycidyl ether of bisphenol A (DGEBA)/methyl tetrahydrophthalic anhydride (MTHPA) and DGEBA/nadic anhydride (NA) were calculated and tested by the method of molecular dynamics (MD) simulation combined with experimental verification. The effects of anhydride curing agents on the thermomechanical properties of epoxy resin were investigated. The results of the simulation and experiment showed that the thermomechanical parameters (glass transition temperature (T_g) and Young’s modulus) of the DGEBA/NA system were higher than those of the DGEBA/MTHPA system. The simulation results had a good agreement with the experimental data, which verified the accuracy of the crosslinking model of epoxy resin cured with anhydride curing agents. The microstructure parameters of the anhydride-epoxy system were analyzed by MD simulation, including bond-length distribution, synergy rotational energy barrier, cohesive energy density (CED) and fraction free volume (FFV). The results indicated that the bond-length distribution of the MTHPA and NA was the same except for C–C bonds. Compared with the DGEBA/MTHPA system, the DGEBA/NA system had a higher synergy rotational energy barrier and CED, and lower FFV. It can be seen that the slight change of curing agent structure has a significant effect on the synergy rotational energy barrier, CED and FFV, thus affecting the T_g and modulus of the system.

Investigating the relationship between microstructure and macroscopic properties of epoxy resin (EP) materials for high-voltage insulation at the molecular level can provide theoretical guidance for the synthetic design of EP. Here, using diglycidyl ether (DGEBA) as the resin matrix and methyl tetrahydrophthalic anhydride (MTHPA) as the curing agent, a set of crosslinked EP molecular models at different curing stages were constructed based on the proposed crosslinking method. We studied the influences of crosslinking density on micro-parameters and macro-properties employing molecular dynamics (MD) simulations. The results indicate that crosslinking of DGEBA/MTHPA is a contraction and exothermic process. The structural parameters and macroscopic properties are closely related to the degree of crosslinking. With the increase of crosslinking density, the mean square displacement (MSD) of the system decreases, and the segment motion in the models is weakened gradually, while, the fractional free volume (FFV) first decreases and then increases. In addition, the thermal and mechanical properties of DGEBA/MTHPA have a significant dependence on the crosslinking density. Increasing crosslinking density can improve the glass transition temperature (T_g), reduce the coefficient of thermal expansion (CTE), and enhances the static mechanical properties of DGEBA/MTHPA system. Furthermore, the relationship between microparameters and properties has been fully investigated. Free volume is an important factor that causes thermal expansion of DGEBA/MTHPA. Moreover, there is a negative correlation between MSD and mechanical moduli. By elevating temperature, the decline in mechanical moduli may be due to the exacerbated thermal motion of the molecules and the increasing MSD values.

Establishing the relationship among the composition, structure and property of the associated materials at the molecular level is of great significance to the rational design of high-performance electrical insulating Epoxy Resin (EP) and its composites. In this paper, the molecular models of pure Diglycidyl Ether of Bisphenol A resin/Methyltetrahydrophthalic Anhydride (DGEBA/MTHPA) and their nanocomposites containing nano-SiO₂ with different particle sizes were constructed. The effects of nano-SiO₂ dopants and the crosslinked structure on the micro-structure and thermomechanical properties were investigated using molecular dynamics simulations. The results show that the increase of crosslinking density enhances the thermal and mechanical properties of pure EP and EP nanocomposites. In addition, doping nano-SiO₂ particles into EP can effectively improve the properties, as well, and the effectiveness is closely related to the particle size of nano-SiO₂. Moreover, the results indicate that the glass transition temperature (T_g) value increases with the decreasing particle size. Compared with pure EP, the T_g value of the 6.5 Å composite model increases by 6.68%. On the contrary, the variation of the Coefficient of Thermal Expansion (CTE) in the glassy state demonstrates the opposite trend compared with T_g. The CTE of the 10 Å composite model is the lowest, which is 7.70% less than that of pure EP. The mechanical properties first increase and then decrease with the decreasing particle size. Both the Young’s modulus and shear modulus reach the maximum value at 7.6 Å, with noticeable increases by 12.60% and 8.72%, respectively compared to the pure EP. In addition, the thermal and mechanical properties are closely related to the Fraction of Free Volume (FFV) and Mean Squared Displacement (MSD). The crosslinking process and the nano-SiO₂ doping reduce the FFV and MSD value in the model, resulting in better thermal and mechanical properties.

The doping of nano-SiO₂ filler is one of the main methods of improving the thermomechanical properties of epoxy resin (EP) composite insulating materials, and the characteristics of the filler is one of the important factors affecting the modification effect. In this paper, the effects of the shape and mass fraction of nano-SiO₂ particles on the microstructure and thermomechanical properties of EP composites were studied by molecular dynamics simulation. The results show that the bonding energy (E_Binding) between the spherical SiO₂ filler and matrix is the largest, and the fraction free volume (FFV) and the mean square displacement (MSD) of the composite model are the lowest. With the increase of the filler mass fraction, the E_Binding between the filler and matrix changed little, whereas both FFV and MSD showed a monotonous downward trend. The introduction of nano-SiO₂ fillers can significantly improve the thermomechanical properties of the composites. The shape of the filler has little effect on the glass transition temperature (T_g), coefficient of thermal expansion (CTE), and mechanical properties of the composites. Increasing the mass fraction of the filler can obviously improve the modification effect. When the mass fraction of SiO₂ is 15 wt. %, the T_g of the material increased by about 35 K, the glass state CTE decreased by about 35%, and the Young’s modulus and shear modulus increased by 24.56% and 32.45%, respectively.