AlCrSiN coatings are promising protective candidates for cutting and forming tools. During the coating deposition process, the microstructure and properties of the coatings were dramatically affected by bias voltages. To further optimize and enhance the AlCrSiN coating, a series of coatings were deposited at different pulse bias voltages using arc ion plating technology. By virtue of scanning electron microscopy, X-ray diffraction, scratch method, OCP, EIS, and other analytical methods, the effects of the pulse bias voltage on the crystal structure, microstructure, and mechanical, tribological, and electrochemical properties of the AlCrSiN coatings were analyzed. The study revealed that the pulse bias voltage exerted a slight influence on the aluminum and nitrogen content of the coatings. As the pulse bias voltage increased, the hardness, critical load, and tribological performance of the AlCrSiN coatings first increased gradually, and then were impaired slightly. When the pulse bias voltage was −100 V, the resulting AlCrSiN coating exhibited the densest structure, the highest hardness, the strongest adhesion, and the best wear resistance. In this case, the coating hardness and critical load reached 2668 HV and 72.7 N, respectively. The friction coefficient and wear rate were 0.35 and 1.02 × 10⁻³ μm³/N·μm, respectively. Simultaneously, the AlCrSiN coating demonstrated exceptional corrosion resistance in 3.5 wt.% NaCl solutions, surpassing uncoated 304 steel by 3~4 times.

By integrating cathodic arc evaporation (CAE) with magnetron sputtering (MS) or high-power impulse magnetron sputtering (HiPIMS), hard coatings with diverse multicomponent compositions can be fabricated. Depending on the deposition conditions, the coatings with nano-composite or nano-multilayered microstructures are produced. During the mixing deposition conditions, nano-composite coatings are fabricated, which can be tailored to possess combining properties of super hardness, low friction coefficient, and excellent thermal/chemical stability. For the deposition with larger rotating periods, layer-by-layer deposition was observed. By the nano-multilayered coating design, superior mechanical properties (hardness ≥ 35 GPa), modulated residual stresses, and enhanced high-temperature properties can be obtained. In addition, lubricious elements, low friction (friction coefficient < 0.4), and low wear (<10⁻⁵ mm³/N∙m) both at ambient temperature and high temperature can be realized. Among these coatings, some have been specifically designed to achieve outstanding cutting performance in high-speed cutting applications. Several nitride and oxide hard coatings, such as AlTiN, TiAlN/TiSiN, AlCrN/Cu, and AlCrO, were deposited using a hybrid industrial physical vapor deposition (PVD) coating system. The microstructure, mechanical properties, and cutting performance of these coatings will be discussed.

Yttrium oxide (Y₂O₃) films have been widely used as protective layers in plasma etching equipment, but achieving stoichiometric films with high deposition rates remains a challenge. In this study, Y₂O₃ films were fabricated by a medium-frequency reactive magnetron sputtering (MF-RMS) technique. The oxygen flow and target control voltage were regulated through a closed-loop feedback control system, which effectively solved the problem. The microstructure, mechanical, optical, and plasma etching properties were systematically investigated. The results showed that near-stoichiometric films can achieve a relatively high deposition rate. Increasing the deposition temperature induced a structural transition in the Y₂O₃ film from a predominantly cubic phase to a mixture of cubic and monoclinic phases. For Y₂O₃ films deposited at room temperature, increasing the bias voltage increased the deposition rate but reduced hardness and elastic modulus. The Y₂O₃ film deposited at 300 °C in the near-metallic mode exhibited the highest hardness and elastic modulus, reaching 13.3 GPa and 222.0 GPa, respectively. All Y₂O₃ films exhibited excellent transmittance and resistance to plasma etching. This study provides an effective protective strategy for semiconductor etching chambers.

As a novel class of thin films, thin-film metallic glasses (TFMGs) hold broad application prospects in biomedicine, electronic components, etc. In this study, CuZr TFMGs were deposited at room temperature using a medium-frequency magnetron sputtering (MFMS) technique. The effects of bias voltage on the microstructure and properties of the films were systematically investigated. The results indicate that the CuZr system exhibits excellent glass-forming ability (GFA), with films possessing a smooth surface. As bias voltage increases, cross-sectional morphology transitions from a glassy morphology to a dimple-like structure. The high bias voltage induces reduced dimple size and significantly increased density. At a bias voltage of −50 V, the hardness of CuZr film reaches a maximum of 9.6 GPa. This hardness is approximately five times and twice that of pure Cu and Zr films, respectively. Compared with Zr film, CuZr TFMGs exhibit a significantly reduced friction coefficient while maintaining a low wear rate. All CuZr films demonstrate excellent electrical conductivity and hydrophobicity, providing the basis for future potential applications.