Directional solidification technology is the core process for manufacturing single-crystal blades in aero-engines, but transverse grain boundaries caused by the competitive growth of polycrystals severely degrade blade performance. To gain a deeper understanding of polycrystalline competitive growth behavior, this study investigates the competitive growth of polycrystals during directional solidification under natural convection based on the phase field and lattice Boltzmann coupling model. By adjusting the solutal expansion coefficient, grain configuration, and pulling velocity, the influence of the flow field on polycrystalline competitive growth is analyzed. The results indicate that changes in the solutal expansion coefficient affect the dendritic competition process and outcome, particularly for dendrites with larger favorably oriented (FO) angles, which are more likely to be eliminated at higher solutal expansion coefficients. Additionally, grain configurations with greater orientation differences between adjacent dendrites are more sensitive to changes in the solutal expansion coefficient, whereas configurations with smaller orientation differences are less affected. It was also found that as the pulling velocity increases, the primary dendrite arm spacing decreases and the growth direction of the dendrites deflects towards the temperature gradient direction. This leads to a reduction in vortices at the dendrite tips and grain boundaries, thereby decreasing the overall flow field intensity. During dendrite growth, solute is rejected from the solid phase, creating a concentration gradient between the dendrite tips and the liquid region. This induces convection in the liquid phase. The interaction between the flow field and the solute concentration in the liquid phase causes the flow field strength and solute concentration to exhibit periodic fluctuations.

Dynamic Shapley additive explanations (SHAP) engineering and hybrid Particle Swarm Optimization (PSO)-Genetic Algorithm (GA) optimization accelerate the inverse design of novel Copper-Titanium (Cu-Ti) alloys, achieving competitive strength-conductivity combinations.