Minseok Lee

Dr. Minseok Lee


Research Focus & Metrics

Academic Career Length

1Year (2026-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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15 January 2026 in Sensors
Verified
Journal Article
Open access
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JKJIN-KYEONG KIM
JIN-KYEONG KIM
MINJAE LEEMINJAE LEE
MINJAE LEE
WLWooseung Lee
Wooseung Lee
MLMinseok Lee
Minseok Lee
CKChang-Mo Kang
Chang-Mo Kang
JKJoonhyub Kim
Joonhyub Kim
In this study, a high-performance MoS2-based strain-gauge pressure was sensor fabricated entirely below 80 °C, enabling direct integration onto flexible polyethylene terephthalate (PET) substrates. The sensor comprised a three-layer MoS2 channel (~2 nm) patterned via dry transfer and O2/Ar plasma etching, interfaced with Cr/Au electrodes. This wafer-scale and cost-effective fabrication route preserves the crystallinity of the film and prevents substrate degradation. The sensor achieved a gauge factor of ~104 under compression, representing a fifty-fold improvement over conventional metal foil gauges (~2), with a linear response across both compressive and tensile regimes. Mechanical robustness was confirmed through repeated bending and tape adhesion tests, with no degradation in electrical performance. When configured as a Wheatstone bridge, this device exhibits normalized sensitivity suitable for real-time monitoring, with response and recovery times below 200 ms. These results establish O2/Ar-plasma-patterned MoS2 architectures as a scalable, cost-effective platform for next-generation flexible sensors, outperforming metal-foil technology in applications including seat-occupancy detection, wearable physiological monitoring, and tactile interfaces for soft robotics.

24 April 2026 in Micro and Nano Systems Letters
Verified
Journal Article
Open access
PDF file
MLMinseok Lee
Minseok Lee
JKJin Yeoup Kim
Jin Yeoup Kim
JKJoonhyub Kim
Joonhyub Kim
Multi-walled carbon nanotubes (MWCNTs) have emerged as promising sensing materials due to their advantages such as room-temperature operation, durability,