With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

Droplet transfer plays a crucial role in welding stability and quality of pulsed gas metal arc weld (GMAW), referring to the process of heat and mass transition. In this work, the appearance, microstructure, microhardness, tensile properties, and impact toughness with three typical modes of droplet transfer in pulsed GMAW (ODMP: one drop per multiple pulses; ODPP: one drop per pulse; MDPP: multiple drops per pulse) were studied and compared. The results showed that the better welding appearance, the deeper penetration, and the less fume covered on the steel plate could be found during the ODPP welding process. At the same wire feeding speed and arc length, the average current was similar in ODPP and MDPP conditions. However, the average current in the ODMP condition was about 15 A larger than the other two, contributing to the higher heat input. Compared with MDPP and ODMP, the longest elongation and impact energy of the welded joint were found in the ODPP condition. Furthermore, the decrease of elongation and impact toughness in the ODMP condition might result from the higher heat input and the coarsen microstructure, like the proeutectoid ferrite and ferrite side plate.

To meet the demand of cryogenic reliability on the electronic packaging for deep space satellite, the three-dimensional interfacial morphology and property of eutectic SnPb solder joint under an extreme thermal shocking of 77–423 K were investigated. After thermal shocking, Cu-Sn IMC layers coarsened in the cross-sectional observation and micro-cracks formed in Cu₆Sn₅ layer. The rough Cu₆Sn₅ layer in the top view gradually smoothed, with broken Cu₆Sn₅ particles and exposed Cu₃Sn. In the bottom-view observation, the Cu₆Sn₅ layer of as-soldered joint was overlapped by Cu₃Sn layer. But no defects were generated in Cu₃Sn layer. The shear force of solder joint was greatly reduced due to broken Cu₆Sn₅ with the changing fracture characteristics from the solder-controlled mode to the solder/IMC mixed mode.

The characteristics of weld bead formation and droplet transfer in pulsed gas metal arc weld (GMAW) with different arc lengths were studied by changing the base current time in this work. The results showed that it was easier to cause short circuits and spatters with a short arc. However, the deviation between the deepest point of penetration and the center of bead will be aggravated with the increase of arc length. In addition, more than 90% “one drop per pulse” (ODPP) transfer mode can be obtained when the pulse parameters were selected properly. However, the short arc trended to rise the proportion of “multiple drops per pulse” (MDPP), and the long arc trended towards increasing the proportion of “one drop per multiple pulses” (ODMP). Additionally, with the growth of the arc in the projected transfer zone, the penetration tended to become shallower because of the increase of arc heat dissipation, the fall of arc energy density, and droplet impact force. Overall, the strategy of choosing suitable arc length of pulsed GMAW was summarized: in order to obtain high-quality bead formation and weld joints, a shorter arc in the projected transfer zone was recommended.

Cosmic radiation has always been the most obvious barrier to planetary travels, especially in long-duration deep space exploration missions. Therefore, the reliability of satellite materials and the requirements of satellite miniaturization have received considerable attention. In this paper, the effect of γ-ray irradiation on the reliability of Sn50Pb49Sb1/Cu solder joints was investigated. It was found that the influence of γ-ray irradiation on the thickness and morphology of the intermetallic compound layer in Sn50Pb49Sb1/Cu was not obvious. However, the formation and growth of micro-voids and micro-cracks was observed in Pb-based solid solutions. Due to the Compton effect, the γ-ray photon could knock the electron out of its orbit, which created the energetic electron. The accumulation of dislocated atoms and lattice vacancies generated by energetic electrons could be the main factor that caused the formation of micro-voids and micro-cracks. The pull force of Sn50Pb49Sb1/Cu solder joints was reduced by 22% after being irradiated at the dose rate of 0.25 Gy(Si)/s for 960 h. Fractographic analysis showed that after irradiation, the fracture type of solder joints was still ductile but the ductility of the solder joints decreased with slightly inconspicuous dimples.