Chengwen Chai

Mr. Chengwen Chai

School of Mechanical and Electrical Engineering, Beijing Institute of Graphic Communication, Beijing, China

Biography

Name: Chai Chengwen; Date of Birth: April 1977; Gender: Male. Highest degree: Master's degree. Main research direction: Research on design and detection technology of printing and packaging machinery. Correspondence address: No. 1, Section 2, Xinghua Street, Daxing District, Beijing. Contact number: 010-6026-1464 Email: chaichengwen@bigc.edu.cn

Affiliations

Beijing Institute of Graphic Communication

Beijing, China

School of Mechanical and Electrical Engineering

Honors and Awards

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Experience

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