Rheology is proposed as a tool to explore plasticized poly(vinyl chloride) (PVC) formulations to be used in the fused filament fabrication (FFF) 3D printing process and so manufactures flexible and ductile objects by this technique. The viscoelastic origin of success/failure in FFF of these materials is investigated. The analysis of buckling of the filament is based on the ratio between compression modulus and viscosity, but for a correct approach the viscosity should be obtained under the conditions established in the nozzle. As demonstrated by small amplitude oscillatory shear (SAOS) measurements, PVC formulations have a crystallites network that provokes clogging in the nozzle. This network restricts printing conditions, because only vanishes at high temperatures, at which thermal degradation is triggered. It is observed that the analysis of the relaxation modulus G(t) is more performing than the G″/G′ ratio to get conclusions on the quality of layers welding. Models printed according to the established conditions show an excellent appearance and flexibility, marking a milestone in the route to obtain flexible objects by FFF.

On the basis of an analysis of results presented in the literature, the currently existing knowledge about relationships between the microstructural and physical properties of hard coatings is discussed. Particular emphasis is placed on the role of microstructural features, such as grain boundaries, nonequilibrium structures, impurities, and texture, in controlling the film hardness. On the basis of an analysis of results presented in the literature, the currently existing knowledge of electrically conductive adhesives (ECAs) is discussed. Particular focus is placed on the results obtained with ECAs that contain carbon nanotubes (CNTs) as conductive fillers. The review is divided in curable ECAs based on epoxy resins, and noncurable conductive hot melts and pressure‐sensitive adhesives based on thermoplastic polymers. More literature results were found for epoxy/conductive filler ECAs than for other adhesives. Confirming the assessments made in a book by Li et al., which refers to nanotechnologies in ECAs, we found that only a reduced number of articles allude to polymer/CNT ECAs. Our analysis of the results includes a study of the balance between the viscosity, immediate adhesion, solidification process, electrical conductivity, and mechanical properties of the adhesives. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013