We report on a zero magnetic field transport study of a two-dimensional, variable-density, hole system in GaAs. As the density is varied we observe, for the first time in GaAs-based materials, a crossover from an insulating behavior at low density, to a metalliclike behavior at high density, where the metallic behavior is characterized by a large drop in the resistivity as the temperature is lowered. These results are in agreement with recent experiments on Si-based two-dimensional systems. We show that, in the metallic region, the resistivity is dominated by an exponential temperature dependence with a characteristic temperature which is proportional to the hole density.

A novel class of micro-electrodes was fabricated by synthesizing high density carbon nanotube islands on lithographically defined, passivated titanium nitride conductors on a silicon dioxide substrate. Electrochemical characterization in phosphate buffered saline of these new electrodes reveals superb electrochemical properties marked by featureless rectangular cyclic voltammetry curves corresponding to a DC surface specific capacitance and a volume specific capacitance as high as 10 mF cm(-2) and 10 F cm(-3), respectively. These electrodes are also characterized by a slowly varying impedance magnitude over the range of 1 Hz to 20 kHz. High fidelity extracellular recordings from cultured neurons were performed and analysed to validate the effectiveness of the fabricated electrodes. The enhanced electrochemical properties of the electrodes, their flexible and simple micro-fabrication preparation procedure as well as their bio-compatibility and durability suggest that carbon nanotube electrodes are a promising platform for high resolution capacitive electrochemical applications.

A technique is described for assembly of multiple batches of micro components onto a single substrate. The substrate is prepared with hydrophobic alkanethiol-coated gold binding sites. To perform assembly, a hydrocarbon oil, which is applied to the substrate, wets exclusively the hydrophobic binding sites in water. Micro components are then added to the water, and assembled on the oil-wetted binding sites. Moreover, assembly can be controlled to take place on desired binding sites by using an electrochemical method to deactivate specific substrate binding sites. By repeatedly applying this technique, different batches of micro components can be sequentially assembled to a single substrate. As a post assembly procedure, electroplating is incorporated into the technique to establish electrical connections for assembled components. Important issues presented are: substrate fabrication techniques, electrochemical modulation by using a suitable alkanethiol (dodecanethiol), electroplating of tin and lead alloy and binding site design simulations. Finally, we demonstrate a two-batch assembly of silicon square parts, and establishing electrical connectivity for assembled surface-mount light emitting diodes (LEDs) by electroplating.