Changmin Li

Changmin Li


Research Focus & Metrics

Academic Career Length

9Years (2018-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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18 October 2018 in Metals
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CLChangmin Li
Changmin Li
LYLiu Yuan
Liu Yuan
YTYuanbiao Tan
Yuanbiao Tan
FZFei Zhao
Fei Zhao
The H13-mod steel optimized by composition and heat treatment has reached the performance index of the shield machine hob. The hot deformation behavior of the H13-mod steel was investigated by compression tests in the temperature range from 900 to 1150 °C and the strain rate range from 0.01 to 10 s−1. The true stress-strain curve showed that the rising stress at the beginning of deformation was mainly caused by work hardening. After the peak stress was attained, the curve drop and the flow softening phenomenon became more obvious at low strain rates. The flow behavior of the H13-mod steel was predicted by a strain-compensated Arrhenius-type constitutive equation. The relationship between the material constant in the Arrhenius-type constitutive equation and the true strain was established by a sixth-order polynomial. The correlation coefficient between the experimental value and the predicted value reached 0.987, which indicated that the constitutive equation can accurately estimate the flow stress during the deformation process. A good linear correlation was achieved between the peak stress (strain), critical stress (strain) and the Zener‒Hollomon parameters. The processing maps of the H13-mod steel under different strains were established. The instability region was mainly concentrated in the high-strain-rate region; however, the microstructure did not show any evidence of instability at high temperatures and high strain rates. Combined with the microstructure and electron backscattered diffraction (EBSD) test results under different deformations, the optimum hot working parameters were concluded to be 998–1026 °C and 0.01–0.02 s−1 and 1140–1150 °C and 0.01–0.057 s−1.

3 September 2026 in Materials Research Letters
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Journal Article
Open access
YBYijie Ban
Yijie Ban
QWQingfeng Wu
Qingfeng Wu
SLShi Woo Lee
Shi Woo Lee
HPHyojin Park
Hyojin Park
JLJun Li
Jun Li
Hyoung Seop KimHyoung Seop Kim
Hyoung Seop Kim
1. Copper alloys, owing to their excellent mechanical properties and high electrical conductivity, are widely used in electronic devices, integrated circuits, and aerospace applications [1–5]. Amon...